Soft, Conformable, Large Area e-Skin

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IEEE Sensors Council - Distinguished Lecture by Dr. Ravinder Dahiya

University of Waterloo (DC 1302), October 25th, 2019 at 4:00PM


IEEE Sensors Council Distinguished Lecture by Dr. Ravinder Dahiya.

Title: Soft, Conformable, Large Area eSkin

Abstract: The miniaturization led advances in microelectronics over 50 years have revolutionized our lives through fast computing and communication. Recent advances in the field are propelled by applications such as robotics, wearable systems, and healthcare etc. through More than Moore technologies. Often these applications require electronics to conform to 3D surfaces and this calls for new methods to realize devices and circuits on unconventional substrates such as plastics and paper. This lecture will present various approaches (over different time and dimension scales) for obtaining distributed electronics and sensing components on flexible and conformable substrates, especially in context with tactile or electronic skin (eSkin). These approaches range from distributed off-the-shelf electronics integrated on flexible printed circuit boards, to advanced alternatives such as eSkin by printed nanowires, graphene and ultra-thin chips, etc. The technology for such sensitive flexible (and possibly stretchable) electronic systems is also the key enabler for numerous emerging fields such as internet of things, smart cities and mobile health etc. This lecture will also discuss how the flexible electronics research may unfold in the future.



  Date and Time

  Location

  Hosts

  Registration



  • University of Waterloo
  • 200 University Avenue West
  • Waterloo, Ontario
  • Canada N2L3G1
  • Building: DC
  • Room Number: 1302

Staticmap?size=250x200&sensor=false&zoom=14&markers=43.47061295%2c 80
  • Co-sponsored by University of Waterloo


  Speakers

Dr. Ravinder Dahiya

Topic:

Soft, Conformable, Large Area e-Skin

The miniaturization led advances in microelectronics over 50 years have revolutionized our lives through fast computing and communication. Recent advances in the field are propelled by applications such as robotics, wearable systems, and healthcare etc. through More than Moore technologies. Often these applications require electronics to conform to 3D surfaces and this calls for new methods to realize devices and circuits on unconventional substrates such as plastics and paper. This lecture will present various approaches (over different time and dimension scales) for obtaining distributed electronics and sensing components on flexible and conformable substrates, especially in context with tactile or electronic skin (eSkin). These approaches range from distributed off-the-shelf electronics integrated on flexible printed circuit boards, to advanced alternatives such as eSkin by printed nanowires, graphene and ultra-thin chips, etc. The technology for such sensitive flexible (and possibly stretchable) electronic systems is also the key enabler for numerous emerging fields such as internet of things, smart cities and mobile health etc. This lecture will also discuss how the flexible electronics research may unfold in the future.

Email:

Address:Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, Glasgow, United Kingdom, G128QQ





All are welcome!