Dr. Bin Zhao of Iotelligent Semiconductor, 10 Goddard, Irvine, CA

Many electronic products are essential in our daily life, which include not only the PCs with microprocessors and memory chips but also the wireless/mobile communication devices, portable multimedia devices, large-scale/high-definition displays, various entertainment systems, home appliances, healthcare wearable devices, smart sensing and IoT. As much increased performance and more diversified features are realized in these electronic products, power dissipation has emerged as a critical challenge under the consideration of energy conservation, chip/system thermal limitations, and product usage time before battery recharging. Mixed-signal IC technologies and design have been critical for communications by providing the needed data conversion between analog and digital signals. They enable the best signal processing in either digital or analog/RF domains to achieve the required performance in a cost-effective way. Mixed-signal technologies and design intelligence also provide formidable solutions for efficient power management in various applications mentioned above. This talk reviews and discusses the challenges in power management and the innovative solutions enabled by mixed-signal design and technologies for the advantages in performance, power efficiency, and cost.

Biography:

Dr. Bin Zhao received his Ph.D. degree from California Institute of Technology. He has been with SEMATECH, Rockwell, Conexant, Skyworks, Freescale, Fairchild, and ON Semiconductor and has worked on advanced VLSI technology development and design implementation of analog/mixed-signal, power management, and RF IC products. He is now CTO and Vice President at Iotelligent Semiconductor, working on semiconductor IC solutions for IoT applications. He has authored and coauthored more than 200 journal publications and conference presentations, has written three book chapters, and holds more than 70 issued US patents. He has served as the Founding Co-Chair, Technical Working Group of RF and Analog/Mixed-Signal IC Technologies for Wireless Communications, International Technology Roadmap for Semiconductors (ITRS); IEEE EDS Vice President of Conferences; IEEE EDS Vice President of Publications; Chair, Editorial Steering Committee, IEEE Journal of Microelectromechanical Systems (J-MEMS); Chair, IEEE Johnson Technology Award Committee; Chair, IEEE Technical Program Integrity Committee; and Chair, IEEE Future of Conference IP Committee. He is an IEEE Fellow and currently serving as Chair of IEEE Conference Committee and Chair of IEEE Conference Governance and Strategy Committee. He is a member of IEEE Technical Activities Board, IEEE Publications Services and Products Board, and IEEE IoT Activities Board.

Email:

Address:Iotelligent Semiconductor, 10 Goddard, Irvine, CA, Irvine, United States, 92618