2020 IEEE 26th International Symposium for Design and Technology in Electronics Packaging
#A.
#Emerging
#Topics
#in
#Advanced
#Packaging;
#B.
#New
#Components
#and
#Manufacturing
#Technologies;
#C.
#Printed
#Electronics
#Smart
#Textiles
#Healthcare;
#D.
#Sensors
#Actuators
#Microsystems;
#E.
#Nanomaterials
#Nanoelectronics
#Nanotechnology;
#F.
#Embedded
#Systems
#Robotics
#Artificial
#Intelligence;
#G.
#Power
#Thermal
#Management;
#H.
#Grid
#Renewable
#Energy;
#I.
#Virtual
#Prototyping
#System
#Validation;
#J.
#Quality
#Management
#Applied
#Reliability;
#K.
#Corrosion
#Electronics;
The symposium combines the oral and poster presentations, in an attractive configuration, as well as individual meetings between professors, students, senior and young scientists who can discuss scientific and educational issues and organize future national and international cooperation. SIITME 2020, the top class, four days professional scientific event is organized by the University of Pitesti, Faculty of Electronics, Communications and Computers, Continental Automotive Romania, MIELE Tehnica Romania, "Politehnica" University of Bucharest, Faculty of Electronics, Telecommunications and Information Technology, Center for Technological Electronics and Interconnection Techniques and Association for Promoting Electronics Technology, APTE.
Date and Time
Location
Hosts
Registration
- Start time: 21 Oct 2020 12:00 PM
- End time: 24 Oct 2020 12:00 PM
- All times are (UTC+03:00) Bucharest
-
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- Str. Trivale 75
- Pitesti, Arges
- Romania 110072
- Building: Cornul Vânătorului Complex
- Contact Event Host
- Co-sponsored by University of Pitesti, Continental Automotive Romania, MIELE Tehnica Romania, "Politehnica" University of Bucharest, Center for Technological Electronics and Interconnection Techniques and Association for Promoting Electronics Technology