IEEE SSCS Oregon Chapter June Meeting and Seminar (Virtual)
IEEE SSCS Oregon Chapter June Meeting and Seminar
Join us for a (virtual) talk from SSCS Distinguished Lecturer Prof. Makoto Nagata of Kobe University, Kobe, Japan on Friday, June 19. The seminar will be held from 6:00pm to 7:30pm (PDT) via WebEx. Please register for the WebEx information.
Abstract:
Interactions of IC chips and packaging structures differentiate the electronic performance of power delivery networks (PDNs) in traditional 2D and advanced 2.5D and 3D technologies. This presentation discusses their impacts on signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC) and electrostatic discharge protection (ESD), through in-depth Si experiments with in-place noise measurements and full-chip level noise simulations. Test vehicles under study are given in traditional 2D face up and flip chip packaging, 2.5D fan-out wafer level packaging (FOWLP), and 3D chip stacking with through silicon vias (TSVs).
Speaker Biography:
Makoto Nagata received the B.S. and M.S. degrees in physics from Gakushuin University, Tokyo, in 1991 and 1993, respectively, and a Ph.D. in electronics engineering from Hiroshima University, Hiroshima, in 2001. He was a research associate at Hiroshima University from 1994 to 2002, an associate professor at Kobe University from 2002 to 2009 and promoted to a full professor in 2009. He is currently a professor of the graduate school of science, technology and innovation, Kobe University, Kobe, Japan. He is a senior member of IEICE and IEEE.
His research interests include design techniques targeting high-performance mixed analog, RF and digital VLSI systems with particular emphasis on power/signal/substrate integrity and electromagnetic compatibility, testing and diagnosis, three-dimensional system integration, as well as their applications for hardware security and safety.
Dr. Nagata has been a member of a variety of technical program committees of international conferences such as the Symposium on VLSI Circuits (2002-2009), Custom Integrated Circuits Conference (2007-2009), Asian Solid-State Circuits Conference (2005-2009), International Solid-State Circuits Conference (2014-2017), European Solid-State Circuits Conference (2020-) and many others. He is chairing the Technology Directions subcommittee for International Solid-State Circuits Conference (2018-present). He is also serving as SSCS AdCom member (2020-). He is currently an associate editor for IEEE Transactions on VLSI Systems (2015-present). He was a technical program chair (2010-2011), a symposium chair (2012-2013) and an executive committee member (2014-2015) for the Symposium on VLSI circuits, and also a chair for IEEE SSCS Kansai Chapter (2017-2018).
Date and Time
Location
Hosts
Registration
- Date: 19 Jun 2020
- Time: 06:00 PM to 07:30 PM
- All times are (GMT-08:00) US/Pacific
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- ONLINE (WEBEX)
- Hillsboro, Oregon
- United States 97124
- Starts 01 June 2020 12:00 PM
- Ends 19 June 2020 05:30 PM
- All times are (GMT-08:00) US/Pacific
- No Admission Charge
Speakers
Makoto Naggata
Next-Generation Chip and System Solutions
Interactions of IC chips and packaging structures differentiate the electronic performance of power delivery networks (PDNs) in traditional 2D and advanced 2.5D and 3D technologies. This presentation discusses their impacts on signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC) and electrostatic discharge protection (ESD), through in-depth Si experiments with in-place noise measurements and full-chip level noise simulations. Test vehicles under study are given in traditional 2D face up and flip chip packaging, 2.5D fan-out wafer level packaging (FOWLP), and 3D chip stacking with through silicon vias (TSVs).
Biography:
Makoto Nagata received the B.S. and M.S. degrees in physics from Gakushuin University, Tokyo, in 1991 and 1993, respectively, and a Ph.D. in electronics engineering from Hiroshima University, Hiroshima, in 2001. He was a research associate at Hiroshima University from 1994 to 2002, an associate professor at Kobe University from 2002 to 2009 and promoted to a full professor in 2009. He is currently a professor of the graduate school of science, technology and innovation, Kobe University, Kobe, Japan. He is a senior member of IEICE and IEEE.
His research interests include design techniques targeting high-performance mixed analog, RF and digital VLSI systems with particular emphasis on power/signal/substrate integrity and electromagnetic compatibility, testing and diagnosis, three-dimensional system integration, as well as their applications for hardware security and safety.
Dr. Nagata has been a member of a variety of technical program committees of international conferences such as the Symposium on VLSI Circuits (2002-2009), Custom Integrated Circuits Conference (2007-2009), Asian Solid-State Circuits Conference (2005-2009), International Solid-State Circuits Conference (2014-2017), European Solid-State Circuits Conference (2020-) and many others. He is chairing the Technology Directions subcommittee for International Solid-State Circuits Conference (2018-present). He is also serving as SSCS AdCom member (2020-). He is currently an associate editor for IEEE Transactions on VLSI Systems (2015-present). He was a technical program chair (2010-2011), a symposium chair (2012-2013) and an executive committee member (2014-2015) for the Symposium on VLSI circuits, and also a chair for IEEE SSCS Kansai Chapter (2017-2018).
Agenda
6:00pm - 7:30pm: Professional/Career Seminar