Pikes Peak IEEE Life Member Affinity Group August Virtual Meeting

#DRAM #Silicon #Mountain #Inmos #Ramtron #United #Memories #Enhanced #Memory #Systems #EDRAM #ESDRAM #HSDRAM #ESRAM
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Silicon Mountain DRAM

Building the World's Fastest PCs

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https://us02web.zoom.us/j/85608880155?pwd=VFl1WDZ0YjNlSk9yVWpVTzJ6NUFhZz09

Meeting ID: 856 0888 0155

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  • Date: 12 Aug 2020
  • Time: 06:00 PM to 07:00 PM
  • All times are (GMT-07:00) US/Mountain
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  • Colorado Springs, Colorado
  • United States

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  • Starts 30 July 2020 03:39 PM
  • Ends 10 August 2020 03:39 PM
  • All times are (GMT-07:00) US/Mountain
  • No Admission Charge


  Speakers

David of Vertical Memory

Topic:

Silicon Mountain DRAM - Building the World’s Fastest PCs

The Dynamic RAM has been the main memory of most computers since the 1970s.  This presentation will tell the story of DRAM development from its beginning and the role of Silicon Mountain (Colorado Springs, CO), in the history of DRAM.  A core team of DRAM designers from Inmos Corporation in Colorado Springs developed the fastest 64Kb and 256Kb DRAM products in the world during the 1980s.  When the team came to Ramtron, a non-volatile DRAM startup in 1986, they developed the first ferroelectric RAM (FRAM). A joint venture company, United Memories, was created between Ramtron and NMB Semiconductor in Japan to develop the fastest 1Mb and 4Mb DRAMs.  Ramtron capitalized on this technology to create a unique cached DRAM product, the Enhanced DRAM, which targeted the highest performance PCs.  Ramtron and its subsidiary, Enhanced Memory Systems developed a series of the fastest PC motherboards and computers during the 1990s using the EDRAM, the Enhanced Synchronous DRAM (ESDRAM) and the Enhanced High Speed DRAM (HSDRAM).  By the 2000s, the Enhanced Memory DRAM technology morphed into the world’s highest density SRAM (ESRAM) and was used as L2 Cache for the high end Hewlett Packard PA-8800 RISC processor. Parts of the same DRAM team from United Memories continues DRAM development in Silicon Mountain today (40-years later) as ISSI.

Biography:

David Bondurant has been involved with the computer and semiconductor industry for 49-years.  He was a computer architect at Control Data, Sperry-Univac, and Honeywell.  He was involved with the government-sponsored advanced semiconductor program called VHSIC (Very High Speed Integrated Circuits) at Univac & Honeywell where he developed microprocessor and ASIC semiconductor products in bipolar CML, CMOS, and radiation hard CMOS.  He was involved with emerging non-volatile RAM marketing at industry leading companies, Ramtron (FRAM), Simtek (non-volatile SRAM), and Freescale Semiconductor/Everspin Technologies (MRAM).  He was VP of Marketing & Applications for Enhanced Memory Systems that developed the Enhanced DRAM, ESDRAM, HSDRAM, and ESRAM.

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Agenda

Introductions

Presentation