Mark of UIUC

Mark Poliks is a Professor of Materials Science and Engineering and Director of the Center for Advanced Microelectronics Manufacturing at Binghamton University. In 2006 he established the first research center to explore the application of roll-to-roll processing methods, including large-area photolithography, to flexible electronics and displays, with equipment funding from the United States Display Consortium (USDC) and the Army Research Lab. His research is in the areas of industry relevant topics that include: high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability. H He is the recipient of the SUNY Chancellor’s Award for Excellence in Research. He leads the New York State Node of the DoD NextFlex Manufacturing USA and was named a 2017 NextFlex Fellow. He has authored more than one-hundred technical papers and holds forty-eight US patents. Previously he held senior technical management positions at IBM Microelectronics and Endicott Interconnect. He is an active member of the IEEE Electronics Packaging Society’s Electronic Component and Technology Conference and served as the 69th ECTC General Chair.

Rohit of IIT Ropar

Biography:

Rohit Sharma (M’07 – SM’15) received the B.E. degree in electronics and telecommunication engineering from North Maharashtra University, India, in 2000, the M. Tech. degree in systems engineering from Dayalbagh Educational Institutes, India, in 2003 and the Ph.D. degree in electronics and communication engineering from Jaypee University of Information Technology, India, in 2009. He worked as a Post-Doctoral Fellow at the Design Automation Lab at Seoul National University, Seoul, Korea from Jan 2010 to Dec 2010. He was a Post-Doctoral Fellow at the Interconnect Focus Centre at Georgia Institute of Technology, Atlanta, USA from Jan 2011 to Jun 2012. Dr. Sharma joined the department of electrical engineering at the Indian Institute of Technology Ropar in 2012, where he is currently an Associate Professor. All along his tenure at IIT Ropar, he has initiated activities in the area of Electronic Packaging. His current research interests include design of high-speed chip-chip and on-chip interconnects, Graphene based nanoelectronic devices and interconnects, Signal and Thermal integrity in high-speed interconnects and 3D ICs/packages and application of Machine Learning in advanced packaging and systems. He is also the coordinator of the Indo-Taiwan Joint Research Centre on Artificial Intelligence and Machine Learning at IIT Ropar. He is an Associate Editor of the IEEE Transactions on Components, Packaging and Manufacturing Technology and a Program Committee member in IEEE EPEPS and IEEE EDAPS. He has been the General Co-Chair of the IEEE EDAPS in 2018. He is the Co-Chair of the IEEE EPS Technical Committee on Electrical Design, Modeling, and Simulation and is a Senior Member of the IEEE.