Design and Manufacturing of an Additive Manufactured Flexible Arduino®-Compatible Microcontroller
Virtual presentation from Mr. Jeff Bergman, Engineering Manager at NextFlex
Abstract
The emerging technology of additive, printed flexible hybrid electronics (FHE) promises to introduce a step change in how electronics are manufactured and used, creating products with innovative packaging and form factors.
As part of an FHE design and manufacturing demonstration project, the NextFlex manufacturing innovation institute, in partnership with AirForce Research Laboratory (AFRL), undertook the translation of the electronic design of an Arduino Mini from standard PCB manufacturing processes into an FHE form factor with a depackaged bare die replacing the standard QFN microprocessor package. The Arduino Mini board is a commonly used tool for prototyping of basic sensing systems, featuring an 8-bit microcontroller (Microchip ATMega328), onboard power regulators, and passive electronic components. Achievements include:
- Development of design rules for the creation of printed FHE circuits
- Creation of high precision traces using a printing process for mounting of bare die ICs
- Development of a process for attachment of a bare die IC to a flexible substrate
This demonstration project showed the suitability of additive printed circuit and FHE technology for the manufacturing of basic embedded systems using bare die attach methodology. This presentation will discuss the design and build process for the bare die Arduino®-compatible microcontroller device as well as more recent advances in the manufacturing of advanced bare die attach processes, suitable for active and passive sensors, on flexible substrates. Fabricating a robust electronic circuit as the basis for sensor and signal applications with unpackaged die, printed traces instead of wires, flexible substrates, and novel attach techniques presents unique challenges along the way to a unique solution.
Date and Time
Location
Hosts
Registration
- Date: 24 Sep 2020
- Time: 01:30 AM to 03:00 AM
- All times are
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- San Jose, Colorado
- United States
- Contact Event Host
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Jeronimo Segovia-Fernandez
Chair, IEEE MEMS & Sensors SFBA Chapter
- Starts 10 September 2020 02:22 PM
- Ends 24 September 2020 01:30 AM
- All times are
- No Admission Charge
- Menu: IEEE Member, Non-IEEE Member
Speakers
Mr. Jeff Bergman
Biography:
Mr. Bergman is the Engineering Manager of the Systems Design and Simulation team, part of the Advanced Technologies group at NextFlex. He also serves as NextFlex’s in house expert on Asset and Structural Health Monitoring Technologies, with more than a decade of experience. After completing his bachelor’s degree, he spent 4 years developing wireless monitoring technologies for civil infrastructure. After completing his MSEE, he went on to hold several positions at Acellent Technologies managing commercial and government projects on cutting-edge technology for structural health and asset monitoring applications on projects for AFRL, NAVAIR, and NASA. Most recently he was Director of Hardware where he developed the first product to be field-deployed on mining equipment. Jeff’s technology experience includes work with sensors and wireless technologies for monitoring of physical assets across a wide array of fields including fixed-wing aircraft, helicopters, mining equipment, bridges, and automobiles.
Agenda
6:30 – 6:45 PM Webex Registration
6:45 – 7:30 PM Invited Talk
7:30 – 7:45 PM Questions & Answers