Defect Detection for Advanced Wafer and Package level devices using Scanning Acoustic Microscopy
Ultrasonic nondestructive inspection is well known in the aircraft, medical, and microelectronics industries. The benefit of ultrasonic inspection is that the interior of samples can be inspected nondestructively. So, there is no need to destroy a part inspecting it only to find out that it was a good part. Thus, aircraft can be inspected in-the-field without having to take them apart, patients can be examined without the need for surgery, and microelectronic devices can be inspected without the need for cross-sectioning or other destructive testing. Common flaw types detectable with ultrasound include delaminations, cracking, and voiding. Due to the small feature sizes in microelectronic samples, a specialized type of ultrasonic inspection called Scanning Acoustic Microscopy (SAM) has been developed. SAM systems allow for much higher resolution inspections and for the detection of additional defects such as die tilt or warpage, wire connects, underfill flow, solder bump integrity, hermetic seal integrity, and missing die. More recently SAM has been applied to the inspection of advanced packages; MEMS, CSI and BSI wafers; and die-on-wafer applications. The increased complexity of layers and materials in these samples has required the development of new inspection techniques. In this presentation, an overview of the capabilities of SAM systems for packages, strips, and bonded wafers will be shown.
Date and Time
Location
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- 1719 Route 10
- Parsippany, New Jersey
- United States 07054
- Starts 01 September 2020 05:33 PM UTC
- Ends 15 September 2020 05:33 PM UTC
- No Admission Charge
Speakers
James of Sonix
Defect Detection for Advanced Wafer and Package level devices using Scanning Acoustic Microscopy
Biography:
- D. in Applied Science with a concentration in Nondestructive Evaluation (NDE) with primary focus being ultrasonic NDE
- 27 years ultrasonic inspection experience
- During the past 22 years, he has been working on Scanning Acoustic Microscopy hardware, software, and inspection techniques for microelectronic sample inspection.
Inventor and holds 10 US patents.
Agenda
Ultrasonic nondestructive inspection is well known in the aircraft, medical, and microelectronics industries. The benefit of ultrasonic inspection is that the interior of samples can be inspected nondestructively. So, there is no need to destroy a part inspecting it only to find out that it was a good part. Thus, aircraft can be inspected in-the-field without having to take them apart, patients can be examined without the need for surgery, and microelectronic devices can be inspected without the need for cross-sectioning or other destructive testing. Common flaw types detectable with ultrasound include delaminations, cracking, and voiding. Due to the small feature sizes in microelectronic samples, a specialized type of ultrasonic inspection called Scanning Acoustic Microscopy (SAM) has been developed. SAM systems allow for much higher resolution inspections and for the detection of additional defects such as die tilt or warpage, wire connects, underfill flow, solder bump integrity, hermetic seal integrity, and missing die. More recently SAM has been applied to the inspection of advanced packages; MEMS, CSI and BSI wafers; and die-on-wafer applications. The increased complexity of layers and materials in these samples has required the development of new inspection techniques. In this presentation, an overview of the capabilities of SAM systems for packages, strips, and bonded wafers will be shown.