7 th International Conference on Microelectronics, Circuits & Systems (MICRO 2020)
Micro2020, the 7th version of the international conference on ‘Microelectronics, Circuits and Systems’ was jointly organized by Delhi Technological University, India and ACT, Kolkata, India. The conference was supported by IEEE EDS Delhi Chapter, India. It was decided and planned that it would be staged in the campus of Delhi Technological University, Delhi, India. But, due to COVID-19 situation, it was organized fully on virtual platform with the help of Google Meet video conferencing software. About 104 participants joined in this conference; among them, about 35 were IEEE members, 30 numbers were invited Guests and others were registered authors-delegates, students and volunteers. There were 6 invited speakers where 4 speakers were from foreign countries(Japan, Poland, Italy, Malaysia) rather than India. In this conference, total 71 papers were received and among those 47 papers were registered and presented.
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- Co-sponsored by MICRO 2020 was jointly organized by Delhi Technological University, India and ACT, Kolkata, India. The conference was only supported by IEEE EDS Delhi Chapter, India
Speakers
Prof. Shinichi Takagi of The University of Tokyo, Japan
Prospects and challenges of advanced CMOS logic devices
Prof. Shinichi Takagi delivered the Keynote talk on "Prospects and challenges of advanced CMOS logic devices"
Biography:
Shinichi Takagi, University of Tokyo Shinichi Takagi received the B.S., M.S. and Ph.D. degrees in electronic engineering from the University of Tokyo. He joined the Toshiba Research and Development Center, Japan, in 1987, where he was engaged in the research on the device physics of Si MOSFETs. From 1993 to 1995, he was a Visiting Researcher at Stanford University, where he studied the strained-Si and SiGe devices. In 2003, he moved to the University of Tokyo, where he is currently working as a professor in the department of Electrical Engineering and Information Systems. He received 18 awards including IEEE Andrew S. Grove Award and IEEE Paul Rappaport Award.
Email:
Address:Department of Electrical Engineering Graduate School of Engineering, The University of Tokyo, Tokyo, Japan
Dr. Jacopo Iannacci of Center for Materials and Microsystems Fondazione Bruno Kessler, Italy
RF-MEMS: An Itinerary through High-Performance Radio Frequency/Millimeter-Wave Passives for the Internet of Things (IoT)
RF-MEMS, i.e. MicroElectroMechanical-Systems for Radio Frequency applications, have been around for about two decades. Across fluctuating expectations on their market employment, RF-MEMS consolidated as a valuable technology to develop high-performance and widely reconfigurable passive components, like ohmic/capacitive micro-relays, variable capacitors/inductors, as well as complex devices, like tunable filters, high-order switching matrices, reconfigurable phase shifters, programmable step attenuators, impedance matching tuners, and so on.
In recent years, the first successful exploitations of RF-MEMS technology in the consumer electronics market segment, and in particular in mobile handsets and smartphones, started to appear on the landscape.
The target of this presentation is to provide an overview on the tangled scenario of RF-MEMS devices, focusing on some significant examples of low-complexity and high-complexity design concepts, developed and prototyped at Fondazione Bruno Kessler (FBK), in Italy. Subsequently, an overview on future applications of RF-MEMS technology in the large market scenarios of 5G and of the Internet of Things (IoT) is developed.
Email:
Address:MicroSystems Technology Research Unit, Center for Materials and Microsystems, Italy