Signal integrity analysis on PCB and interconnects
IEEE North Jersey Section Co-sponsors the event
This webinar is created for engineers who work on signal integrity with digital designs. It will focus on aspects of channel influence through PCB and interconnects such as impedance mismatch, losses and frequency response on PCB material, unintended crosstalk, and resonant structures. By reference to vector network analyzers and oscilloscopes, it will discuss typical measurements such as return and insertion loss, mode conversion, skew, impedance over time, crosstalk, and eye diagram. Measurement examples and demonstrations will be breathing life into the theory and building a preference for the best solution fit.
For login information, please register by clicking the online link: Register Now
Date and Time
Location
Hosts
Registration
- Date: 19 Jan 2021
- Time: 07:00 PM UTC to 08:00 PM UTC
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- Virtual Technical Webinar Meeting
- Virtual, New Jersey
- United States
- Building: Virtual
- Contact Event Hosts
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Ajay Poddar (akpoddar@ieee.org), Durga Misra (dmisra@njit.edu), Edip Niver (edip.niver@njit.edu), Anisha Apte (anisha_apte@ieee.org), Ionel Bajescu (nelu108@yahoo.com)
- Co-sponsored by IEEE North Jersey Section
- Starts 05 January 2021 03:00 PM UTC
- Ends 19 January 2021 07:00 PM UTC
- No Admission Charge
Speakers
Dr. Alexander Kuellmer of Rohde & Schwarz
Signal Integrity Analysis on PCB and Interconnects [webinar]
This webinar is created for engineers who work on signal integrity with digital designs. It will focus on aspects of channel influence through PCB and interconnects such as impedance mismatch, losses and frequency response on PCB material, unintended crosstalk, and resonant structures. By reference to vector network analyzers and oscilloscopes, it will discuss typical measurements such as return and insertion loss, mode conversion, skew, impedance over time, crosstalk, and eye diagram. Measurement examples and demonstrations will be breathing life into the theory and building a preference for the best solution fit.
For Webinar login information, please register by clicking the online link: Register Now
Biography:
Dr. Alexander Kuellmer received his master's degree in Electrical Engineering and Information Technology at University Stuttgart, Germany, in 2009 and his Doctor of Engineering degree at the Technical University of Braunschweig at the institute for EMC in 2016. Since then, he has been working as an Application Engineer for digital test solutions and joined Rohde & Schwarz in 2018.
Address:Rohde & Schwarz,
Joern Pfeifer of Rohde & Schwarz
Signal Integrity Analysis on PCB and Interconnects
For login information, please register by clicking the online link: Register Now
Biography:
Joern Pfeifer studied Electronics Engineering at the University of Applied Sciences in Emden, Germany, and graduated with a degree in High-Frequency Engineering. As an Application Engineer, he joined Rohde & Schwarz in 2016 and focuses on high-speed digital design applications. He is a contributing member of the OPEN Alliance Automotive Ethernet TC9 working group.
Address:Rohde & Schwarz,
Agenda
This Webinar will begin on Tuesday, January 19, 2021, at 02:00 PM EST (Eastern Standard Time).
Duration: 1 hour
For login information, please register by clicking the online link: Register Now