Power Integrity: Ensuring Robust End-to-End Power Delivery-

#power #delivery #solution #for #high-performance #microprocessors #(xPUs #FPGA #ASIC #etc.)
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A robust power delivery solution for high-performance microprocessors (xPUs, FPGA, ASIC etc.) requires voltage at the active junction to be within the specified range to ensure timing closure, and also requires the VR and PDN to support ever increasingly complex power management features. The source of power comes from conversion circuitry which usually transforms higher voltage to a much more granularly regulated form lower than 1V DC in most cases, and then is distributed through board, package and on-die network and decoupling all the way to the active circuits. In the past, power designers and signal/power integrity engineers have worked together to address the conversion and distribution challenges in frequencies ranging from KHz to GHz, but the methodologies used by the two groups are decoupled. In today’s high-performance computing processors, many of which are used in machine learning, artificial intelligence and cloud applications, we have seen transformations of computing architecture that result in changes in power demand signatures, and thus call for new ways of power delivery solution. To address these new challenges, a holistic approach that combines power conversion together with power integrity design becomes a must. In this presentation, we will explore the risks and opportunities in this area and share our considerations in practical designs.

 



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  • Date: 15 Feb 2021
  • Time: 04:30 PM to 05:30 PM
  • All times are (GMT-05:00) US/Eastern
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  • minjie@princeton.edu 



  Speakers

Topic:

Power Integrity: Ensuring Robust End-to-End Power Delivery

Speaker: Dr. Houle Gan

 Staff Hardware Engineer at Google

Biography:

Bio: Houle Gan received his Ph.D. degree in Electrical and Computer Engineering from Purdue University in 2010. He is currently a Staff Hardware Engineer at Google, where he leads the power delivery solutions of Google’s custom machine-learning platforms. Before that he was with Apple and Intel. His research interests include signal/power integrity, power management techniques, and advanced packaging. He is the recipient of the 2013 IEEE AP-S best paper award of the IEEE Transactions on Antennas and Propagation, and has over 30 IEEE publications in peer reviewed journals and conferences.