SWISS IEEE EPS EVENT (Webinar): Trends in Thermal Management of Electronic systems

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This webinar will include a talk on roadmap of thermal management in heterogenous integration and two talks on trends in advancing  thermal management for high power devices.

Agenda:

16:30 - 16:35 : Welcome and Introduction

16:35 - 17:10 : "Heterogeneous Integration Roadmap Thermal Technical Working Group (TWG) Update", Dr. Weihua Tang, Intel Corporation, USA

17:10 - 17:25 : "Passive two-phase cooling in power electronics", Dr. Daniele Torresin, Principal Scientist, ABB Research Center, Switzerland

17:25 - 17:40 : "Active cooling: a solution for low TCE, high thermal conductivity packages", Dr. Arno Hoogerwerf, Senior Expert, CSEM SA, Switzerland

17:40 - 17:45 : General discussions and closure 

 

The video conferencing link will be provided to registered attendees.

Please Join at 16:30 [CET], please mute your microphone.

 



  Date and Time

  Location

  Hosts

  Registration



  • Date: 09 Jun 2021
  • Time: 04:30 PM to 05:45 PM
  • All times are Europe/Zurich
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  • , Switzerland
  • Switzerland

  • Starts 29 March 2021 06:00 AM
  • Ends 07 June 2021 10:00 PM
  • All times are Europe/Zurich
  • No Admission Charge


  Speakers

Dr. Weihua Tang of Intel Corporation

Topic:

“Heterogeneous Integration Roadmap Thermal Technical Working Group (TWG) Update”

Update on Thermal Working Group of the Heterogeneous Integration Roadmap

Biography:

Dr. Weihua Tang manages a Research and Development engineering team that specializes in thermal and fluids competency with a focus on package thermal technologies, thermal modeling methodology, and fundamental understanding of semiconductor substrate packaging, assembly, and test process covering a broad range of product segments. She has 10+ years of experience in the semiconductor industry. She is an associate editor of IEEE Transactions on Electronic packaging  soceity and a contributor to IEEE HIR Thermal Technical Working Group. Weihua holds a Ph.D. in mechanical engineering from the University of Minnesota

Address:Intel Corporation, , Switzerland

Dr. Daniele Torresin of ABB Research Center

Topic:

"Passive two-phase cooling in power electronics"

Biography:

Dr. Daniele Torresin holds a Ph.D on heat and mass transfer from the University of Padova (Italy). He is working at ABB Corporate Research as a Principal scientist with experience in the research fields of Single and two-phase cooling of power electronics. He is also a Project manager of R&D project for next generation cooling of low voltage drives. He has Published more than 20 papers and holds 20 patents.

Address:ABB Research Center, , Baden-Dättwil, Switzerland