Novel mm-Wave/Terahertz Transceivers Overcoming the Fundamental Limitations of Conventional Architectures

#IC #high #speed #circuits #Microwave #mm-Wave #Terahertz #Transceivers
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There is a widely held belief that going all digital solution is the pathway to design modern RF transceivers. This talk challenges this very notion for emerging next-G wireless communication. This seminar shows that when it comes to implementation of ultra-high data rates in excess of 10 Gbps, going all way to 100 Gbps and above, the all-digital design faces some incredible challenges that are impossible to address in silicon technologies. The talk then presents the novel idea of realizing modulation and demodulation schemes directly in RF domain. Three transmitter/receiver chip prototypes are presented that utilize this idea to achieve extremely power-efficient 15+ Gbps data rates.


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  • Date: 19 Nov 2021
  • Time: 02:00 PM to 03:30 PM
  • All times are (GMT-08:00) US/Pacific
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  • 4100 East Peltason Dr, Irvine, CA
  • Irvine, California
  • United States 92617
  • Building: California Institute for Telecommunication and Information Technology
  • Room Number: Suite 4318
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  • Starts 01 November 2021 12:00 PM
  • Ends 18 November 2021 12:00 AM
  • All times are (GMT-08:00) US/Pacific
  • No Admission Charge

  Speakers

Payam Heydari Payam Heydari of University of California, Irvine

Topic:

Novel mm-Wave/Terahertz Transceivers Overcoming the Fundamental Limitations of Conventional Architectures

Biography:

Payam Heydari is currently the University Chancellor’s Professor at the University of California, Irvine. His research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. A recipient of the 2021 IEEE Solid-State Circuits Society (SSCS) Innovative Education award, four best paper awards, and an NSF CAREER Award, Dr. Heydari is an IEEE Fellow and has been the IEEE Distinguished Lecturer of both IEEE Solid-State Circuits and IEEE Microwave Theory and Techniques Societies. He is the (co)-author of two books, one book chapter, and more than 170 journal and conference papers. Dr. Heydari currently serves as Associate Editor of both IEEE Journal of Solid-State Circuits and IEEE Solid-State Circuits Letters. Formerly, a member of technical program committee of International Solid-State Circuits Conference (ISSCC), he is currently a TPC of ESSCIRC and International Microwave Symposium. 




Agenda

2:00PM-2:25PM Meet and greet Prof. Payam Heydari

2:25PM-2:30PM Welcome and housekeeping announcements

2:30PM-3:15PM Prof. Payam Heydari talk

3:15PM-3:30PM Q&A