IEEE SSCS Oregon Chapter December Meeting and Seminar (Virtual)
IEEE SSCS Oregon Chapter December Meeting and Seminar
Join us for a (virtual) talk from Dr. Sharma of Intel Labs on Friday, December 10th. The seminar will be held from 8:00am to 9:30am (PST) via a Virtual format. Please register for the meeting link and information.
Topic:
Co-packaged silicon-photonics based optical transceivers for high-speed datacenter interconnects
Abstract:
Silicon photonics based optical interconnects (I/O) are being explored as a viable alternative to circumvent the reach, bandwidth and power limitations of electrical interconnects for data-centers. Current high-volume products for optical data-center interconnects are in the form of pluggable modules composed of discrete electronics and photonics ICs that plug into server racks. These modules are still limited in energy efficiency due to the relatively long (inches-long) high-speed electrical interconnect between the pluggable module and the XPU. However, recent advances in ultra-compact silicon-based optical modulators and integrated lasers, along with a migration of the interface electronics to densely-integrated silicon processes have led to the development of compact optical I/O modules. These can be collocated on the same package as the XPU (‘co-packaged’) to reduce the length of the high-speed electrical interconnect between the XPU and the optical module to only a few centimeters resulting in advantages in energy efficiency and shoreline bandwidth density. In this talk, I will review prototypes of our silicon-based intensity-modulated optical transceivers and our recent work on scaling optical I/O data-rates at iso-energy efficiency through the use of dense wavelength division multiplexing (DWDM).
Speaker Biography:
Jahnavi Sharma is a researcher with Intel Labs, Hillsboro, OR, USA. She received the dual bachelor’s and master’s degrees in electrical engineering from IIT Madras, Chennai, India, in 2009, and the M.S. and Ph.D. degrees (with a focus on signal synthesis) in electrical engineering from Columbia University, New York, USA in 2015 and 2017 respectively. She has held internship positions with IBM Yorktown Research Center in 2014, and with Bell Labs in 2013 and 2015. She was the recipient of the IBM Ph.D. Fellowship Award in 2015. Her research interests include developing integrated circuit solutions for emerging wireline and wireless applications, pushing performance through both system- and block-level innovations in CMOS and compound semiconductors.
Date and Time
Location
Hosts
Registration
- Date: 10 Dec 2021
- Time: 08:00 AM to 09:30 AM
- All times are (GMT-08:00) US/Pacific
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- Hillsboro, Oregon
- United States 97124
- Starts 08 November 2021 12:00 AM
- Ends 10 December 2021 07:45 AM
- All times are (GMT-08:00) US/Pacific
- No Admission Charge
Speakers
Jahnavi Sharma
Co-packaged silicon-photonics based optical transceivers for high-speed datacenter interconnects
Silicon photonics based optical interconnects (I/O) are being explored as a viable alternative to circumvent the reach, bandwidth and power limitations of electrical interconnects for data-centers. Current high-volume products for optical data-center interconnects are in the form of pluggable modules composed of discrete electronics and photonics ICs that plug into server racks. These modules are still limited in energy efficiency due to the relatively long (inches-long) high-speed electrical interconnect between the pluggable module and the XPU. However, recent advances in ultra-compact silicon-based optical modulators and integrated lasers, along with a migration of the interface electronics to densely-integrated silicon processes have led to the development of compact optical I/O modules. These can be collocated on the same package as the XPU (‘co-packaged’) to reduce the length of the high-speed electrical interconnect between the XPU and the optical module to only a few centimeters resulting in advantages in energy efficiency and shoreline bandwidth density. In this talk, I will review prototypes of our silicon-based intensity-modulated optical transceivers and our recent work on scaling optical I/O data-rates at iso-energy efficiency through the use of dense wavelength division multiplexing (DWDM).
Biography:
Jahnavi Sharma is a researcher with Intel Labs, Hillsboro, OR, USA. She received the dual bachelor’s and master’s degrees in electrical engineering from IIT Madras, Chennai, India, in 2009, and the M.S. and Ph.D. degrees (with a focus on signal synthesis) in electrical engineering from Columbia University, New York, USA in 2015 and 2017 respectively. She has held internship positions with IBM Yorktown Research Center in 2014, and with Bell Labs in 2013 and 2015. She was the recipient of the IBM Ph.D. Fellowship Award in 2015. Her research interests include developing integrated circuit solutions for emerging wireline and wireless applications, pushing performance through both system- and block-level innovations in CMOS and compound semiconductors.
Agenda
8:00am - 9:30am: Professional/Career Seminar