Ball Grid Array Placement Reliability Concerns on Printed Circuit Boards

#Reliability #Safety #Big #Data
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Talk Synopsis: 
BGAs are increasingly being used in automotive and autonomous environments where ruggedness is a requirement. Typically, the primary concern in these environments is shock and vibration. In solving this problem an “over constrained PCB” may arise. When a PCB is over constrained the solder fatigue from temperature cycling of sensitive parts like BGAs may be significantly reduced. This presentation will review strain sensitive components, the basics behind thermal cycling solder fatigue, and the potential influence of the chassis on solder fatigue.

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  • Date: 07 Dec 2021
  • Time: 06:00 PM to 08:00 PM
  • All times are (GMT-06:00) CST6CDT
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  Speakers

Michael Blattau of Ansys

Topic:

Ball Grid Array Placement Reliability Concerns on Printed Circuit Boards

Michael Blattau brings over 20 years of experience in Electronics Reliability. He is currently a Senior Reliability Engineer at Ansys, where he has helped hundreds of customers in different industry verticals with electronic reliability challanges. Prior to working for Ansys he was a Design Engineering Supervisor for over a decade with an embedded computer manufacturer. He brings expertise in electronics enclosure design, PCB layout, and FEA simulation and has a M.S., Electronic Packaging.

Biography:

  • Michael Blattau brings over 20 years of experience in Electronics Reliability. He is currently a Senior Reliability Engineer at Ansys, where he has helped hundreds of customers in different industry verticals with electronic reliability challanges. Prior to working for Ansys he was a Design Engineering Supervisor for over a decade with an embedded computer manufacturer. He brings expertise in electronics enclosure design, PCB layout, and FEA simulation and has a M.S., Electronic Packaging.

Address:United States




Agenda

6:00 Online Networking

6:15 Speaker

8:00  Close meeting