Integration and Packaging Strategies for Millimeter-Wave CMOS

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Millimeter-wave CMOS circuits are being developed for consumer products operating up to 100 GHz and beyond. Applications range from 77 GHz automotive radar to spectrometers for gas analysis operating from 200 to 300 GHz. High data rate communication systems for wireless and wireline applications take advantage of the wide bandwidth available at millimeter-wave frequencies. While the design of active components and sub-circuits has been explored by many, there is still a need to provide integration and packaging strategies that remain low in cost and high in performance.

This presentation will cover results related to the integration of CMOS circuits from 150 GHz to 325 GHz using post-CMOS and printed circuit board techniques. A 200GHz to 300 GHz spectrometer design will be presented with interconnect and antenna studies using a post-CMOS process to deposit low-loss polymers. In addition results on passive components and antennas designed for a 120 Gbps wireline system will be presented. In this work, on-chip antennas are used to excite a broadband rectangular waveguide. The electromagnetic simulation studies along with measured results will be presented for these two application areas.



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  • Hanover Manor
  • 16 Eagle Rock Avenue
  • East Hanover , New Jersey
  • United States 07936

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  • Co-sponsored by IEEE North Jersey Section
  • Starts 01 September 2021 01:00 PM UTC
  • Ends 07 October 2021 01:00 PM UTC
  • No Admission Charge


  Speakers

Dr. Rashaunda Henderson, 2022 IEEE MTT-S President Dr. Rashaunda Henderson, 2022 IEEE MTT-S President of University of Texas

Topic:

Integration and Packaging Strategies for Millimeter-Wave CMOS

Millimeter-wave CMOS circuits are being developed for consumer products operating up to 100 GHz and beyond. Applications range from 77 GHz automotive radar to spectrometers for gas analysis operating from 200 to 300 GHz. High data rate communication systems for wireless and wireline applications take advantage of the wide bandwidth available at millimeter-wave frequencies. While the design of active components and sub-circuits has been explored by many, there is still a need to provide integration and packaging strategies that remain low in cost and high in performance.

 This presentation will cover results related to the integration of CMOS circuits from 150 GHz to 325 GHz using post-CMOS and printed circuit board techniques. A 200GHz to 300 GHz spectrometer design will be presented with interconnect and antenna studies using a post-CMOS process to deposit low-loss polymers. In addition results on passive components and antennas designed for a 120 Gbps wireline system will be presented. In this work, on-chip antennas are used to excite a broadband rectangular waveguide. The electromagnetic simulation studies along with measured results will be presented for these two application areas.

Biography:

Dr. Rashaunda Henderson received the B.S.E.E. degree from Tuskegee University, Tuskegee, AL, in 1992, and the M.S. and Ph.D. degrees in electrical engineering from The University of Michigan, Ann Arbor, MI, in 1994 and 1999, respectively. From 1999 to 2007, she worked as an R&D device engineer at Freescale Semiconductor, formerly known as Motorola Semiconductor Product Sector.

Since Fall 2007, she has been investigating novel passive components and integration techniques for millimeter-wave circuits and systems. She advises a team of students in the design, fabrication, and characterization of high-performance transmission lines, circuits, and electronic packages for frequencies operating up to 300 GHz. Dr. Henderson is a senior member of the IEEE.

Dr. Rashaunda is active in the MTT-S through MTT-11, the Education Committee, and IMS TPRC. She is the treasurer for RWS 2015 and previously served as the Student Paper Contest Co-Chair from 2012-2014.

Email:

Address:University of Texas, , United States





Agenda

For further information contact:

IEEE NORTH JERSEY SECTION CHAIR & MTT/AP CHAPTER CHAIR – AJAY KUMAR PODDAR  (201-560-3806),akpoddar@ieee.org

CHAIR -  GENERAL-EXHIBITION: KIRIT DIXIT (201-669-7599), kdixit@ieee.org

CHAIR – TECHNICAL PROGRAMS: GEORGE KANNELL(973-261-1421),george.kannell@gd-ms.com

THERE IS NO CHARGE TO ATTEND THE SYMPOSIUM OR SHOW.