Fifth Annual Symposium on Heterogeneous Integration

#heterogeneous #integration #advanced #packaging #3D #SiP

In addition to seven key talks with a global perspective on Wednesday, February 23rd, we have two days of detailed presentations/discussions across the 23 Working Groups to address needed cross-TWG issues in preparation for the next edition of the Roadmap.  Talks from packaging experts:  -- Heterogeneous Integration: A Roadmap to the Next Era of Moore’s Law;  -- Could We Work on The Demand Side Too … Please?;  -- The Roaring 20s – A Renaissance for the Semiconductor Industry;  -- Bridging Chip Design to Applications Through Heterogenous Integration;  -- Tera-Scale-Integration: Optimized Heterogeneous and Monolithic Integration;  -- The Future is Heterogeneous Integration;  -- 3D Heterogeneous Integration (HI): An Enabler for Next Generation Systems;  plus panels:  -- Package Architecture and Co-Design;  -- SiP and Modules for Automotive Applications.  We value your participation and inputs.