IEEE EMC Society "Meet and Greet"
Join us for an IEEE Electromagnetic Compatibility (EMC) Society hosted "Meet and Greet"! The IEEE EMC Society is celebrating 65 years as an IEEE Society and will celebrate this milestone at its 2022 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity from August 1-5 in beautiful Spokane, Washington. Attend our event and learn what you can look forward to at the Symposium!
EMC Society President Dr. Vignesh Rajamani welcomes you to meet with EMC Society representatives who are visiting Spokane in preparation for the Society's annual symposium in August. Associate Professor John Tadrous, Advisor to the Gonzaga University IEEE Club, and students look forward to welcoming you as well! Held at the Spokane Convention Center the first week in August, the Symposium offers over 200 technical presentations, with papers, workshops, tutorials, hands-on demonstrations/experiments, "Ask the Experts" panels, and standards committee meetings, plus a large exhibition and social events. Over 1,000 attendees are expected for the first IN-PERSON EMC Society Symposium held since 2019. Learn more about the Symposium at this "Meet and Greet" and visit www.emc2022.emcss.org
Light dinner and refreshments provided.
Please be respectful of COVID protocol in place as perscribed by The Onion Taphouse and Grill at the time of this meeting.
Date and Time
Location
Hosts
Registration
- Date: 09 Feb 2022
- Time: 02:30 AM UTC to 04:30 AM UTC
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Speakers
Vignesh Rajamani of Exponent
Overview of the IEEE EMC Society
The Field of Interest of the Society involves engineering related to the electromagnetic environmental effects of systems to be compatible with themselves and their intended operational environment. This includes standards, measurement techniques and test procedures, instrumentation, equipment and systems characteristics, interference control techniques and components, education, computational analysis, and spectrum management, along with scientific, technical, industrial, professional or other activities that contribute to this field.
Biography:
Dr. Vignesh Rajamani is an expert in the electromagnetic characterization and application of reverberation chambers with Exponent. A main thrust of his research and project experience in the area of reverberation chambers has been towards increasing test accuracy. His expertise includes statistical electromagnetics, validation and optimization techniques for computational electromagnetics, communication system testing in complex multipath environments, EMI/C Issues with Unmanned Aerial Systems, antenna systems and radio frequency (RF) design, and estimation probability of failure of electronic systems due to electromagnetic interference and compatibility. In his role as a Manager at Exponent, he assists clients with identifying the root cause of the failures of electronic systems and providing guidance on possible solutions, especially in the area of EMI/C.
Dr. Rajamani is the President of the IEEE Electromagnetic Compatibility (EMC) Society and involved with several technical committees and educational activities in the EMC Society. He served as the Vice President of Member Services for the IEEE EMC Society from 2014-2020. He is a Senior Member of IEEE and served as a Distinguished Lecturer for the IEEE EMC Society for term 2013-2014. He has lectured around the world on reverberation chamber test methodologies and has taught design engineering seminars for faculty and students at many universities focusing on challenges in engineering education and prepare the faculty to handle them by spreading a significant number of Project Based Learning (PBL) classes across the curriculum. Prior to joining Exponent, Dr. Rajamani was with Oklahoma State University as a Visiting Assistant Professor where he taught courses in engineering design and performed research in probability of failure of electronic systems in harsh electromagnetic environments.
Address:Phoenix, Arizona, United States
John Tadrous of Gonzaga University
Introduction to Gongaza University IEEE Club
Biography:
John Tadrous is an Associate Professor of Electrical and Computer Engineering at Gonzaga University. He received his Ph.D. degree in electrical engineering from the ECE Department at The Ohio State University in 2014, an MSc degree in wireless communications from the Center of Information Technology at Nile University in 2010, and a BSc degree from the EE Department at Cairo University in 2008. Between 2016 and 2021 he served as an assistant professor of electrical and computer engineering at Gonzaga University. From May 2014 to August 2016 he was a post-doctoral research associate with the ECE Department at Rice University. In 2020, Dr. Tadrous was elevated to a Senior Member of the IEEE. In addition, he received the Gonzaga University's Faculty Award for Professional Contributions. His research interests include Modeling and analysis of human behavior's impact on data networks in various timescales from seconds to hours. This research spans interdisciplinary fields of human behavioral science, economics, machine learning, and big data analytics. He also works on the design of optimal resource allocation strategies that harness developed human behavioral models for maximal network welfare. This research utilizes information theory, network optimization and control, and smart-data pricing. Dr. Tadrous' served as a technical program committee member for several conferences such as Mobihoc and WiOpt. He also served as a peer reviewer for a multitude of scientific conferences and journals.
Address:Spokane , Washington, United States
Agenda
6:30 pm - Arrival and Check-In
6:45 pm - Welcome by Vignesh Rajamani, President, IEEE EMC Society and John Tadrous, Advisor, Gonzaga University IEEE Club
6:55 pm - Overview of the IEEE EMC Society + Q&A: President Rajamani with Exponent
7:10 pm - Overview of the IEEE EMC Society Symposium in Spokane: Janet O'Neil, Symposium General Chair with ETS-Lindgren
7:15 pm - Highlights of the Symposium Technical Program and Special Opportunities for Students: Frank Leferink, Symposium Technical Program Chair with Thales and University of Twente, Netherlands
7:25 pm - Highlights of the Symposium Exhibition: Alistair Duffy, Symposium Exhibits and Sponsors Chair with De Montfort University, UK
7:30 pm - Meet and Greet! Network with speakers above plus Dennis Lewis, EMC Society VP Conferences with Boeing (Seattle) and Mark Steffka, 2023 EMC Society Symposium Chair with University of Detroit-Mercy
8:30 pm - Adjourn
Please contact organizer Janet O'Neil at j.n.oneil@ieee.org or call/text cell 425-443-8106 if you have any questions about this event. Kindly register to attend to ensure adequate seating and catering. Note space at this event is limited; if you register but realize you cannot attend, please contact Janet O'Neil so another person may take your place. Thank you!