WIE Industrial Invited Talk


This virtual talk is co-sponsored by: 1) IEEE Kitchener -Waterloo WIE (Chair: Dr Fattane Zarrinkalam) and 2) IEEE Canada External Relation Committee (Chair: Dale Tardiff). The goal of these technical series is to bring experts from industry to provide high-level overview of the recent developments in different areas.

  Date and Time




  • Date: 31 Mar 2022
  • Time: 03:00 PM to 04:00 PM
  • All times are (GMT-05:00) America/Toronto
  • Add_To_Calendar_icon Add Event to Calendar


Gamal Refai-Ahmed of Life Fellow ASME


Roadmap Based on Holistic Understanding of Thermo-Mechanical Challenges from Package to System to Maximize Silicon Perfo

This presentation is addressing the impact of the assembly and manufacturing technology and direction on the advancing packaging Mechanical integrity and its thermal characterizations. In this talk, the audiences will be able to see clearly the full picture to answer the question of will Lidded or Lidless Advanced Packaging have better Thermo-Mechanical Characteristics?. The answer to this question needs to have a full understanding of the manufacture and assembly, materials behavior, the cost, the mechanical stresses, the end user application, and the target thermal performance.  It is not a surprised to find a wrong direction can impact the package performance and lose more than 30% to 50% of its performance.


Dr. Gamal Refai-Ahmed, Life Fellow ASME, Fellow IEEE, Fellow Canadian Academy of Engineering, Professional Engineer Ontario, is Xilinx Fellow at AMD .  He obtained the Ph. D. degree from the University of Waterloo. He has been recognized as one of the global technical leaders through his numerous publications (more than 110 publications) and patents& patents pending US (more than 60) and International (more than 110). His contributions are clearly seen in several generations of both GPU, CPU and FPGA for HPC, AI, ML, NIC, Game Console, Aerospace& Defense and Telecom products.  In 2015, Gamal was tasked to  initiate the heterogeneous integration of system level power, thermal, mech and assembly with package and Si development in first initial planning.  He has been a key player to introduce all Alveo products and high-end Si  CoWos, InFo, Chiplets  PKG  to AMD Customers. He was behind the introduction of the first Lidless FPGA   20, 16, 7nm technology nodes with highest warpage in mass production in  Alveo products, and its Telecom, AI, HPC customers (e.g. MSFT, AWS, Nokia, Cisco and A&D).  his developed strategy of technology enable AMD FPGA  products to outperform the Intel/Altera Products.  Gamal is the recipient of 2008 excellent thermal management award, 2010 Calvin Lecture and 2013 K16- Clock award in recognition for his scientific contributions and leadership of promoting best electronics packaging engineering practice. In 2014, Gamal received the IEEE Canada R. H. Tanner Industry Leadership for sustained leadership in product development and industrial innovation. In 2016, ASME awarded Gamal the ASME Service Award. State University of New York, Binghamton University awarded him the Innovation Partner Award for his industrial role with Binghamton University. In continuation to Dr Refai contributions to the best engineering practice, State University of New York at Binghamton awarded him the Presidential University medal in 2019 which is the highest recognition honor by the university.  In 2021, Gamal was elected to IEEE Fellow and  EIC Fellow.