IEEE EMC Society Chicago Chapter Virtual Presentation April 13, 2022
Title: SnapShot® Board Level Shielding - Solving Many of Today’s EMI Shielding Challenges
Presented By: Jon Buchwald XGR Technologies
IEEE EMC Society Chicago Chapter Virtual Meeting 4-13-22
Date and Time
Location
Hosts
Registration
- Date: 13 Apr 2022
- Time: 06:30 PM to 08:00 PM
- All times are (GMT-06:00) US/Central
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- 1250 Peterson DR
- WHEELING, Illinois
- United States 60090
- Building: 1250 Peterson DR
- Contact Event Hosts
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Jack Black
Chapter Chair
IEEE EMC Society- Chicago
j.black@ieee.org
- Starts 06 April 2022 07:17 PM
- Ends 13 April 2022 07:17 PM
- All times are (GMT-06:00) US/Central
- No Admission Charge
Speakers
Jon Buchwald of XGR Technologies
Title: SnapShot® Board Level Shielding - Solving Many of Today’s EMI Shielding Challenges
Abstract: This webinar will demonstrate how a novel use of solder spheres as an attachment mechanism for a unique board level EMI shield solves many of the short comings of traditional, board level shielding cans. Specifically, XGR’s solder sphere system addresses the inability to inspect and re-work, poor co-planarity, and penalizing board real estate requirements. The result is an extremely rugged, durable, and lightweight shielding solution for demanding applications
Biography:
Jon Buchwald joined XGR Technologies to run the Sales and Marketing department and bring SnapShot® technology to the broader market. Jon comes to XGR after 22 years at W.L. Gore & Associates where he held positions in engineering, new product development, new business development, and business leadership. His educational background includes a Bachelor’s degree in Mechanical Engineer and a Master’s degree in Business Administration.
Email:
Address:XGR Technologies, 560 Peoples Place, Newark, Delaware, United States, 19072
Agenda
6:30-6:45 Chapter Announcements
6:45 to 7:30 Featured Presentation
7:30 to 8:00 Q and A
IEEE EMC Society Chicago Chapter
www.emcchicago.org