EEE SWISS SSC Lecture (Hybrid) / Trans-impedance amplifiers design: from ultra-low-power analog to ultra-wideband RF

#Circuit #Design #CMOS #RF

Dear Members,

We hope all of you are doing well,

Your Swiss Solid State Circuit Society chapter is please to host Prof. Danilo Manstretta,

On Friday the 3rd of June.

The topic of the lecture is : " rans-impedance amplifiers design: from ultra-low-power analog to ultra-wideband RF "

The lecture will be Held at ETH Zurich ETZ E81

The Agenda is as follow:

17:00 - 17:05 Welcome participants

17:05 - 18:00 Lecture

18:00 - 18:15 Questions / Discussion

We look forward meeting you and having fruitful discussion.

Kind regards,

Mathieu Coustans

For your IEEE Switzerland Solid State Circuit Society committee.

  Date and Time




  • Date: 03 Jun 2022
  • Time: 05:00 PM to 06:15 PM
  • All times are (UTC+01:00) Bern
  • Add_To_Calendar_icon Add Event to Calendar
  • ETH Zurich
  • Zurich, Switzerland
  • Switzerland
  • Building: ETZ
  • Room Number: ETZ 85

  • Contact Event Host
  • Starts 24 May 2022 08:37 AM
  • Ends 03 June 2022 12:00 AM
  • All times are (UTC+01:00) Bern
  • No Admission Charge


Danilo Manstretta of Uni Pavia


Trans-impedance amplifiers design: from ultra-low-power analog to ultra-wideband RF

TIAs are employed in many different systems, from wireless transceivers to qubit manipulation and readout in quantum computing or as low-noise amplifiers in optical receivers front-ends. In this talk a few TIA design examples will be presented, covering different type of applications. Performance requirements change dramatically depending on the application, leading to a wide variety of implementation styles and circuit techniques. TIAs can be broadly grouped into two categories, i.e. closed-loop and open-loop topologies. Closed loop TIAs generally have better frequency response precision and can achieve higher dynamic range, but typically have higher power dissipation and limited bandwidth. Open loop topologies are preferred when very wide bandwidth or ultra-low power dissipations are required. Nearly every wireless receiver includes a TIA after the down-conversion mixer. In wireless sensor networks or Internet-of-Things (IoT), bandwidth is limited but power dissipation is reduced to a minimum, leading to ultra-low-power TIAs that consume only a few uW.In 5G FR1 receivers, TIAs with tens of MHz bandwidth and very high dynamic range are required. Closed-loop architectures are dominant, often with complex op-amp architecture and with and power consumptions in the order of a few mW. In 5G FR2 receivers, TIAs with hundreds of MHz to a few GHz bandwidth are used, mostly based on open-loop topologies with power dissipations of tens of mW. To conclude the overview, TIAs for electro-optical interfaces will be presented. In optical receivers a low-noise TIA is required to amplify the current detected by the photodiode. These TIAs have tens of GHz of bandwidth and can consume up to hundreds of mW power


Danilo Manstretta (Member, IEEE) received the MS degree (summa cum laude) and the Ph.D. degree in electrical engineering and computer science from the University of Pavia, Pavia, Italy, in 1998 and 2002, respectively.

From 2001 to 2003 he was with Agere Systems as a Member of Technical Staff, working on WLAN transceivers and linear power amplifiers for base stations.

From 2003 to 2005 he was with Broadcom Corporation, Irvine, CA, working on RF tuners for TV applications.

In 2005 he joined the University of Pavia, where he is now Associate Professor. His research interests are in the field of analog, RF, optical and millimeter-wave integrated circuit design.

Dr. Manstretta has been member of the Steering Committee of the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium since 2017. He was TPC member for the same conference from 2006 to 2021 and he is the TPC co-chair in 2022. Since 2022 he is member of the TPC of ESSCIRC. He was Guest Editor of the IEEE Journal of Solid-State Circuits May 2017 Special Section dedicated to the 2016 RFIC Symposium and Guest Editor of the IEEE Transactions on Microwave Theory and Techniques June 2018 Mini Special Issue dedicated to the 2017 RFIC Symposium. He was co-recipient of the 2003 IEEE Journal of Solid-State Circuits Best Paper Award.