Practical RF PCB Design: Wireless Networks, Products and Telecommunications
THIS COURSE HAS BEEN CANCELLED!!
Overview: One of the most demanding consumer products in the market is the wireless telecommunication product. A well-designed Radio Frequency Printed Circuit Board (RF PCB) contributes significantly to the success of any wireless product as the layout of the PCB greatly affects the performance, stability and reliability of the product. In today’s highly competitive wireless products market with increasingly compressed development time-frame, there is a strong demand for RF professionals who possess the knowledge and experience to design top-performing RF PCBs in less number of iterations. What matters is whether your level of competence is up to the required standard to meet such demand.
Audience: RF Designers, Wireless Product Designers, Field Application Engineers, Design Managers and related professionals.
Benefits: This course aims to provide participants with an insightful training on RF PCB design from a practical, industrial perspective. Participants will be led through a systematic, theoretical presentation with case studies on commercial products in the training. The course will be conducted by an RF expert with rich industrial experience. It is suitable for RF professionals who want to keep up-to-date their skills and knowledge in RF PCB design and stay competitive.
Date and Time
Location
Hosts
Registration
- Start time: 04 Jan 2023 09:00 AM
- End time: 05 Jan 2023 04:30 PM
- All times are (UTC-05:00) Eastern Time (US & Canada)
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- Crowne Plaza Hotel
- 15 Middlesex Canal Park Road
- Woburn, Massachusetts
- United States 01801
- Starts 26 July 2022 12:00 PM
- Ends 19 December 2022 10:00 AM
- All times are (UTC-05:00) Eastern Time (US & Canada)
- Admission fee ?
Speakers
Henry Lau
Expertise: Henry Lau received his M.Sc. and MBA degrees from UK and USA respectively. He has more than 25 years of experience in designing RF systems, products and RFICs in both Hong Kong and US. He worked for Motorola and Conexant in US as Principal Engineer on developing RFICs for cellular phone and silicon tuner applications. Mr Lau holds five patents all in RF designs. He is currently running Lexiwave Technology, a fables semiconductor company in Hong Kong and US designing and selling RFICs, RF modules and RF solutions. He has also been teaching numerous RF-related courses internationally.
Biography:
Expertise: Henry Lau received his M.Sc. and MBA degrees from UK and USA respectively. He has more than 25 years of experience in designing RF systems, products and RFICs in both Hong Kong and US. He worked for Motorola and Conexant in US as Principal Engineer on developing RFICs for cellular phone and silicon tuner applications. Mr Lau holds five patents all in RF designs. He is currently running Lexiwave Technology, a fables semiconductor company in Hong Kong and US designing and selling RFICs, RF modules and RF solutions. He has also been teaching numerous RF-related courses internationally.
Address:United States