Practical Approaches to Industrializing Near-THz Communications Systems
In the past few years, we have seen the proliferation of mm-Wave communication radios due to the global effort to make ultra-high capacity 5G a reality. Such systems benefit not only from RFIC innovations but also from packaging, material engineering, and co-design of various elements to produce scalable and manufacturable products. Near-THz is poised to offer even higher peak capacity for a new generation of 6G wireless networks. This workshop focuses on the path to making near-THz systems manufacturable at scale and at a price point suitable for mass deployment. This workshop will present various RFICs, packaging, and interposer technology operating at D-Band (110GHz - 170GHz) and capable of achieving tens of gigabits per second at high spectral efficiency.
Date and Time
Location
Hosts
Registration
- Date: 06 Oct 2022
- Time: 11:15 AM to 12:00 PM
- All times are (UTC-04:00) Eastern Time (US & Canada)
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- 16 Eagle Rock Avenue
- East Hanover, New Jersey
- United States 07936
- Building: Hanover Manor
- Contact Event Host
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Dr. Ajay K. Poddar, Chair IEEE North Jersey Section, Email: akpoddar@ieee.org
- Starts 20 September 2022 12:00 PM
- Ends 06 October 2022 11:55 PM
- All times are (UTC-04:00) Eastern Time (US & Canada)
- No Admission Charge
Speakers
Dr. Michael Holyoak
Practical Approaches to Industrializing Near-THz Communications Systems
Biography:
Michael Holyoak is an IEEE Senior Member and a Distinguished Member of Technical Staff in the RFIC & Packaging Research Lab at Nokia Bell Labs. Mike received a B.S. degree in engineering from The College of New Jersey (TCNJ) in 2009 and an M.S. degree in engineering from Columbia University in 2011. Post-college, he worked at LGS Innovations, the former U.S. government division of Alcatel-Lucent, where he aided in the design of System- and Antenna-in-Package technology operating up to 110 GHz. In 2018, Mike joined Nokia Bell Labs to lead the development of advanced RFIC packaging technologies for next-generation wireless and sensing networks. He and his team have recently demonstrated Radio-on-Glass and Backhaul-on-Glass modules operating in D- and E-band. Mike is proficient in various electromagnetic simulation software tools and is a Keysight Certified Expert. He received the ISSCC 2018 Lewis Winner Award for outstanding Paper and the RFIC Industry Best Paper Award in 2015, 2020, and 2022. Michael is also an inventor for his contributions made to MEMS tunable filters and multi-band antenna arrays.
Address:United States
Dr. Shahriar Shahramian
Practical Approaches to Industrializing Near-THz Communications Systems
Biography:
Dr. Shahriar Shahramian (SM ’06) received his Ph.D. degree from the University of Toronto in 2010 where he focused on the design of mm-wave data converters and transceivers. Shahriar has been with the Bell Laboratories – Nokia since 2009 and is currently the Lab Leader (Director) of the RFIC & Packaging Research Lab. His research focus includes the design of mm-wave wireless and wireline integrated circuits and systems. Shahriar is a Bell Labs Fellow and leads the design and architecture of several state-of-the-art ASICs for optical coherent and wireless backhaul products. Shahriar serves as the chair mm-Wave & THz subcommittee of IEEE BCICTS & mm-Wave SoCs at IEEE
RFIC and member of the technical program committee IEEE ISSCC. He has also served as the guest Editor of the IEEE Journal of Solid-State Circuits (JSSC). Shahriar has been the recipient of the Ontario Graduate Scholarship, the University of Toronto Fellowship, and the best paper award at the CSICS Symposium in 2005, and 2015 RFIC Symposium in 2015, 2020, and ISSCC in 2018. Shahriar is also the recipient of the IEEE MTT Young Engineer Award in 2020. He holds an Adjunct Associate Professor position at Columbia University has received several teaching awards and is the founder and host of The Signal Path educational video series. Shahriar has also presented short courses and workshops at the IEEE CSICS, BCTM, BCICTS, RFIC/IMS, and ISSCC conferences.