Sixth Annual Symposium on Heterogeneous Integration and Annual Meeting

#HIR #packaging #electronics #integration
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-- Plenary Presentations from NIST, DoD, IBM, Samsung, Intel, AMD, ITRI, Penn State; key updates from Working Groups;feedback & dialogue ...

Future Vision for Heterogeneous Integration from Global Perspectives, 2 days, 8 plenary talks, working groups ...

Invited Plenary Presentations "Critical Issues in Electronics Resurgence for next decade & beyond";   Key messages from groupings of the HIR Chapters (with cross-TWG panels); Cross TWG Collaboration & Dialogue; Planning for 2023 conference events, workshops & collaboration.

Register SEPARATELY for the two pre-symposium tutorials on Chiplets, and on NIST-sponsored Roadmaps at:

https://events.vtools.ieee.org/m/339402

For updated program information visit: https://r6.ieee.org/scv-eps/?p=3003


  Date and Time

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  • Start time: 23 Feb 2023 05:00 PM UTC
  • End time: 25 Feb 2023 12:30 AM UTC
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  • SEMI World Hdqtrs
  • 673 S Milpitas Blvd
  • Milpitas, California
  • United States 95035
  • Contact Event Host
  • Starts 08 December 2022 01:31 AM UTC
  • Ends 24 February 2023 08:31 PM UTC
  • 6 in-person spaces left!
  • Admission fee ?
  • Menu: No restrictions, Vegetarian, Kosher/ Halal, Other- contact organizer