Material Trends in Fan-out WLP (Wafer Level Package) and PLP (Panel Level Package)
-- larger areas, high-volume, business case, new materials, sustainability, advantages, challenges ...
Fan-out Wafer and Panel Level Packaging are gaining relevance as high-volume-compatible advanced packaging technologies. Providing technical advantages and optimized cost for manifold applications, FOWLP and PLP are fundamentally changing the packaging infrastructure. In the past, OSATs dominated high-volume manufacturing, but recently new players in packaging such as semiconductor foundries, PCB or LCD manufacturing companies entered this business area and are changing not only supply chains but also form factors towards larger areas. However, materials are playing an important role especially for future applications such as RF, power or advanced computing applications. In addition, materials are also a key factor for cost and sustainability. In summary, the presentation will discuss recent technical developments as well as the changing ecosystem and actual advantages and challenges when moving to large-panel-level manufacturing.
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- Date: 28 Mar 2023
- Time: 08:00 AM to 09:00 AM
- All times are (UTC-07:00) Pacific Time (US & Canada)
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Kitty Pearsall Edited on March 18, 2024
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Speakers
Tanja Braun of Fraunhofer IZM
Material Trends in Fan-out WLP (Wafer Level Package) and PLP (Panel Level Package)
Fan-out Wafer and Panel Level Packaging are gaining relevance as high-volume-compatible advanced packaging technologies. Providing technical advantages and optimized cost for manifold applications, FOWLP and PLP are fundamentally changing the packaging infrastructure. In the past, OSATs dominated high-volume manufacturing, but recently new players in packaging such as semiconductor foundries, PCB or LCD manufacturing companies entered this business area and are changing not only supply chains but also form factors towards larger areas. However, materials are playing an important role especially for future applications such as RF, power or advanced computing applications. In addition, materials are also a key factor for cost and sustainability. In summary, the presentation will discuss recent technical developments as well as the changing ecosystem and actual advantages and challenges when moving to large-panel-level manufacturing.
Biography:
Dr. Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. In 2013 she received her Dr. degree from the Technical University of Berlin for work focusing on humidity diffusion through particle-filled epoxy resins. Tanja Braun is head of the Assembly & Encapsulation Technologies group. Recent research is focused on fan-out wafer and panel level packaging technologies and she is leading the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin. Results of her research concerning packaging for advanced packages have been presented at multiple international conferences. Tanja Braun also holds several patents in the field of advanced packaging. In 2014 she received the Fraunhofer IZM research award and in 2021 the Exceptional Technical Achievement Award from the IEEE Electronics Packaging Society (EPS) and the IMAPS Sidney J. Stein Award. Tanja Braun is an active member of IEEE. She is member of the IEEE EPS Board of Governors (BOG) and is the IEEE EPS Region 8 Program Director.
Address:Berlin, Germany