LED Solder Joint Reliability Factors in IM
Talk Synopsis:
This presentation will show the potential influence of routing, copper weight, and dielectric selection on solder fatigue from thermal cycling on a ceramic LED.
Date and Time
Location
Hosts
Registration
- Date: 18 Apr 2023
- Time: 06:00 PM to 08:00 PM
- All times are (UTC-05:00) Central Time (US & Canada)
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- Co-sponsored by Angela Robinson
- Starts 27 March 2023 09:00 AM
- Ends 18 April 2023 05:30 PM
- All times are (UTC-05:00) Central Time (US & Canada)
- No Admission Charge
Speakers
Michael Blattau of Lead Engineer, Ansys
LED Solder Joint Reliability Factors in IMS
Many times, routing influences on solder fatigue are overlooked and on traditional FR4 PCB substrates they don’t influence the thermal fatigue reliability. However, on insulated metal substrate PCBs it can dramatically influence the solder joint reliability on many low CTE (ceramic) components. This presentation will show the potential influence of routing, copper weight, and dielectric selection on solder fatigue from thermal cycling on a ceramic LED.
Biography:
Michael Blattau brings 20 years of experience in Electronics Reliability. He is currently a Lead Consulting Engineer at Ansys, where he has helped hundreds of customers in different industry verticals on electronic reliability issues. Prior to working for Ansys he was a Design Engineering Supervisor for over a decade with an embedded computer manufacturer. He has knowledge of electronics enclosure design, PCB layout, and FEA simulation and has a M.S., Electronic Packaging.
Address:United States
Agenda
6:00 Online Networking
6:15 Speaker
8:00 Close meeting