Forest Zhu of University of Technology Sydney

With the explosive growth of mobile traffic demand, the contradiction between capacity requirements and spectrum shortage becomes increasingly prominent. The limited wireless spectrum at lower-frequency region, such as RF/microwave (below 30 GHz), becomes a critical issue for the 5G wireless networks. On the other hand, huge bandwidth can be offered in millimetre wave (mm-Wave) region (from 30 to 300 GHz). Consequently, the mm-Wave communications have been proposed to be an important part of the 5G mobile network to provide multi-gigabit communication as well as low-latency real-time sensing services. Most of the current research has been focused on 28-39 GHz band for cellular networks, 60 GHz band for high-speed Wi-Fi, E-band for back-haul systems and 77 GHz band for automotive anti-collision radar. In particular, rapid progress in silicon-based mm-Wave integrated circuits (ICs) paves the way for electronic products in mm-Wave region and for the above applications.

In this talk, the aim is to report the recent advances in this active research area. Specifically, it will cover the design of passive components, such as couplers and filters, and also linear and nonlinear active circuits that use either novel electromagnetic structures or special design methodologies to fulfil different design specifications.

Biography:

Xi (Forest) Zhu received the B.Eng. and Ph.D. degrees in Electronic Engineering from the University of Hertfordshire, Hatfield, U.K., in 2005 and 2008, respectively. Since 2016, he has been with the School of Electrical and Data Engineering, University of Technology Sydney, NSW, Australia. He has co-authored more than 120 papers in international journals and conferences. His current research interests primarily focus on the design of analog/mixed-signal integrated circuits and radio frequency integrated circuits (RFICs) for wireless communication and radar sensing applications.

Dr. Zhu was named Australia’s top researcher in the field of Microelectronics and Electronic Packaging (in the discipline of Engineering) by The Australian 2023 Research Magazine. He is an active reviewer for the IEEE Trans. on Circuits and Systems – I: Regular Papers and – II: Express Briefs. Also, he serves as a member of the Technical Review Board for several IEEE journals and conferences, including ISCAS, the flagship conference organised by the IEEE Circuits & Systems Society (CAS-S). He is also a member of the IEEE MTT-S TC-14: Microwave and mm-wave Integrated Circuits Committee, and the IEEE CAS-S Analog Signal Processing Technical Committees (ASPTC). He is currently an Associate Editor of the IEEE Trans. on Circuits and Systems – II: Express Briefs, and IET Microwaves, Antennas and Propagation.

Address:School of Electrical and Data Engineering, , University of Technology Sydney, Sdyney, New South Wales, Australia