Mark Poliks of SUNY Binghamton

Biography:

Mark D. Poliks is a SUNY Distinguished Professor of Materials Science and Engineering and Systems Science and Industrial Engineering at the Thomas J. Watson College of Engineering and Applied Science, Binghamton University, State University of New York.  He is the founding director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of the federally supported NextFlex Manufacturing USA.  Poliks has made sustained contributions to the fields of electronics packaging, flexible and hybrid electronics that are relevant to a variety of medical and industrial applications.  He has had significant experience in the electronics industry serving as a senior technical manager at the IBM Corporation and as director of R&D at Endicott Interconnect Technologies, Inc.  He was the General Chair of the 69th IEEE Electronic Components and Technology Conference (ECTC).  He is a Fellow of NextFlex, an elected member of the IEEE Electronics Packaging Society (EPS) Board of Governors, serves as the director of student programs and is an IEEE EPS Distinguished Lecturer.

Annette Teng of TAP

Title: Overview of AIM Photonics Test Assembly and Packaging (TAP) Facility

Abstract: Packaging can add up to 75% of the cost of an integrated photonic device and is often a substantial barrier in the development of these technologies. The AIM Photonics TAP (Test, Assembly, and Packaging) Facility is a 300mm compatible packaging fab that was established to facilitate prototyping of integrated silicon photonic solutions by providing innovators with state-of-the-art equipment and expertise to implement their design vision. This talk will describe TAP as a full service microelectronic and integrated photonic packaging facility located in Rochester, NY. The facility is open access, supporting a broad range of customers from large and small companies, academia and government. This talk will describe the capabilities and offerings of TAP which houses more than 80 tools for wafer level packaging, chip packaging, fiber attach, process verification and testing.

Biography:

Annette is currently the Director of Package Integration at AIM Photonics Test, Assembly and Packaging (TAP) Facility in Rochester, NY.   She was previously the chief technology officer at Promex Industries which is a microelectronics subcontractor located in Silicon Valley.  She has worked in IC component packaging and assembly at Philips Semiconductor, Linear Technology, Integra in US and Silanna in Australia.   She was at Hong Kong University of Science and Technology to initiate their electronics packaging programs from 1997 to 2000.  She is past Chair of the IEEE-EPS Santa Clara Chapter and is currently the IEEE EPS Regional Director of Region 1-7 and 9.  She received her Ph.D. in Materials Engineering from The University of Virginia and BSc from Sweet Briar College.

Sunny Son of TEL Technology Center America

Biography:

Dr Ilseok (Sunny) Son is manager of 3DI & Heterogeneous Integration team in TEL Technology Center, America (TTCA) at Albany NY. Prior to joining TTCA in 2021, Sunny led NAND hybrid bonding team and R&D metrology team in SK Hynix to define resolution paths for next generation memory devices.  He previously worked on 3DI technology and EUV at INTEL Component Research, and received Intel Achievement Award (IAA) from his work on 3DI research & development. Sunny obtained his PhD in Electrical Engineering from University of Wisconsin – Madison with specialty in MEMS.