Introduction to Camera Technology: Packaging Challenges
-- computer-vision, detection, system design, module hardware, packaging ...
Cameras have become key sensors in many products, e.g., cellphones, automotive, and AR/VR. Though cameras were traditionally invented to mimic human perception, the recent development of artificial intelligence (AI) enabled cameras in an increasing number of computer vision applications (e.g., gesture control, object detection), which also brings additional challenges in camera development and packaging. This talk will first provide a brief introduction to the camera system, including both camera module hardware and the image processing pipeline, and then discuss how different applications affect camera development and packaging.
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- Date: 22 Jun 2023
- Time: 11:30 AM to 01:00 PM
- All times are (UTC-07:00) Pacific Time (US & Canada)
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- SEMI World Hdqtrs
- 673 S Milpitas Blvd
- Milpitas, California
- United States 95035
Speakers
Zack Lai of Meta Reality Labs
Introduction to Camera Technology: Packaging Challenges
Cameras have become key sensors in many products, e.g., cellphones, automotive, and AR/VR. Though cameras were traditionally invented to mimic human perception, the recent development of artificial intelligence (AI) enabled cameras in an increasing number of computer vision applications (e.g., gesture control, object detection), which also brings additional challenges in camera development and packaging. This talk will first provide a brief introduction to the camera system, including both camera module hardware and the image processing pipeline, and then discuss how different applications affect camera development and packaging.
Biography:
Dr. Zhenhua (Zack) Lai is currently a Depth Tech Lead at Meta Reality Labs (previously Facebook Oculus), leading 2D/3D camera development. Prior to Meta, Dr. Lai worked on cameras in various industries, including autonomous driving at Lyft and Woven Planet, electrical vehicle (EV) at Byton, and mobile at Motorola. Dr. Lai has published a book chapter at Springer, 13 scientific papers, and holds multiple patents.