Dr. Dongkai Shangguan, IEEE Fellow of Thermal Engineering Associates, Inc. USA

In advanced packaging, as newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. Finer pitch interconnects in advanced packaging are more susceptible to failures due to electromigration, interfacial reactions etc. Wafer level packaging, Cu direct bonding and other advanced packaging technologies, present new considerations in interconnect reliability. At the same time, the growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms.
As electronic products become more pervasive in application, interconnect reliability must be considered holistically with regard to environmental conditions, from thermal, mechanical, and thermomechanical, to electrical and electrochemical. High frequency applications demand considerations of interconnect materials for signal integrity. High thermal density and high current density can have increased impact on interconnect reliability. These considerations will impact reliability engineering for semiconductor devices, from design for reliability, to accelerated testing and analysis.
Sustainability of electronic products demands environmentally friendly materials and processes, and understanding of the failure mechanisms for different interconnect materials at various levels (wafer, chip, package, and system) of the semiconductor package is of great importance to interconnect reliability in advanced packaging and heterogeneous integration.

Biography:

Dr. Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is President of Thermal Engineering Associates, Inc. (TEA), and a Strategic Advisor to innovative companies in the global semiconductor and electronics industry. Previously, he served as Corporate Vice President at Flex (formerly Flextronics) and as Chief Marketing Officer at STATSChipPAC (currently JCET). Early in his career, he held various technical and management responsibilities at Ford Electronics and Visteon.

Dr. Shangguan has published two books, authored/co-authored over 200 technical papers, and has been issued 30 U.S. patents.

Dr. Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the William D. Ashman Achievement Award from IMAPS, the President’s Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers.

Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. in Materials from the University of Oxford, U.K. He conducted post-doctoral research at the University of Cambridge and The University of Alabama.

Dr. Shangguan is based in San Jose, California, and travels globally in service of the industry.