CANELOS: CAD and Nanoelectronics Seminar (Día 2)

#utfsm #CANELOS #microelectronica

Este jueves 29 y viernes 30 de junio continúa CANELOS, el nuevo seminario que busca convocar a toda la comunidad de microelectrónica de Chile.

CANELOS es un evento enfocado en la microelectrónica y su industria, abordando tanto el diseño de circuitos integrados como la automatización y las herramientas de diseño asistido. El seminario se realizará los días 16, 29 y 30 de junio, en el maravilloso campus de la UTFSM en Valparaíso. Serán 3 días que incluyen charlas plenarias, presentaciones y un foro. Los charlistas son académicos y representantes de empresas, varios de los cuales viajarán desde el extranjero. 

El evento es abierto y gratuito, y busca reunir presencialmente a la comunidad de microelectrónica de todo el país, así como a contactos en latinoamérica. Se trata de una instancia con enfoque educativo, pero también una oportunidad de generar contactos con la academia y la industria. El futuro de la microelectrónica nacional será un tema recurrente en las conversaciones, y también la pregunta que trataremos de resolver durante el foro. 

  Date and Time




  • Date: 29 Jun 2023
  • Time: 09:00 AM to 06:15 PM
  • All times are (UTC-04:00) Santiago
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  • UTFSM, Av. España #1680
  • Valparaiso, Valparaiso
  • Chile 2390123
  • Building: T

  • Contact Event Hosts
  • Co-sponsored by AC3E, Departamento de Electrónica de La UTFSM


Dr. Hanh-Phuc Le of University of California San Diego


Integrated Power Converter - A Good Design Flow and Useful Techniques

While integrated power converter is required in every modern electronic system, designing one that achieves both area- and power-efficient continues to be a big challenge in many engineering teams. In this talk, the speaker will discuss a good design flow and a number of useful techniques in designing integrated power converters that he has accumulated over the last ~20 years of his career. The flow includes a process of coming up with a converter concept; discussing topology trade-off; a general, fundamental, but intuitive loss analysis and optimization; and design verification. Design techniques include different circuit techniques and important layout considerations. 


Dr. Hanh-Phuc Le is an Assistant Professor of ECE at the University of California San Diego and a co-Director of the Power Management Integration Center, an NSF IUCRC center. He received the Ph.D. degree from UC Berkeley (2013), M.S. from KAIST, Korea (2006), and B.S. from Hanoi University of Science and Technology in Vietnam (2003), all in Electrical Engineering. In 2012, he co-founded and served as the CTO at Lion Semiconductor until October 2015. The company was acquired by Cirrus Logic in 2021. He was with the University of Colorado Boulder from 2016 to 2019, before joining the ECE department at UC San Diego. He held R&D positions at Oracle, Intel, Rambus, JDA Tech in Korea and the Vietnam Academy of Science and Technology (VAST) in Vietnam. His current research interests include miniaturized/on-die power conversions, large conversion ratios, smart power delivery and control for high performance IT systems, data centers, telecommunication, robots, automotive, mobile, wearable, and IoT applications. 

Dr. Le received a 2021 NSF CAREER Award, a 2012-2013 IEEE Solid-State Circuits Society Pre-doctoral Achievement Award, and UC Berkeley's 2013 Sevin Rosen Funds Award for Innovation. He authored three book chapters, over fifty journal and conference papers with one best paper award, recognized in various topics in the area of integrated power electronics. He is an inventor with 21 U.S. patents (11 granted and 10 pending). He serves as an associate editor of the IEEE Journal of Emerging and Selected Topics in Power Electronics (JESTPE), TPC Chair/co-chair for the International Workshop on Power Supply On Chip (PwrSoC 2018, 2020), and Chair of the Power Management and Outreach Subcommittees at the IEEE Custom Integrated Circuits Conference  (2020, 2021), and Vice Chair of the Energy Conversion Congress and Exposition (ECCE) 2021. He is also the Chair of the IEEE Power Electronics Society Technical Committee on Power Components, Integration, and Power ICs (IEEE PELS TC2). Dr. Le is an IEEE Senior Member.

Dr. Ioannis Vourkas of Universidad Federico Santa María


Circuit Design for Memristive Devices - Open Research Fields & Applications


Ioannis Vourkas (Member, IEEE) received the M.Eng. (Diploma) and the Ph.D. degrees in electrical and computer engineering (ECE) from the Democritus University of Thrace (DUTh), Greece, in 2008 and 2014, respectively. In 2015, he became a Postdoctoral Researcher with the Pontifical Catholic University of Chile (PUC). Currently, he is an Associate Professor (Tenure) with the Department of Electronic Engineering, Universidad Técnica Federico Santa María (UTFSM), Valparaíso, Chile, where he has been an Associate Researcher with the AC3E Research Center, since 2018. His current research interests include ReRAM characterization, modeling, and simulation, on novel circuits and architectures for ReRAM-centric computing, unconventional and in-memory computing, and the software and hardware aspects of parallel bio-inspired computational circuits and systems. He is the main author of one book, three book chapters, of more than 25 international journal articles and more than 40 papers included in peer-reviewed conference proceedings. He is a member of IEEE CASS and NanoGiga TC. He has been serving in the Editorial Board for IEEE Transactions on Nanotechnology (since 2021) and Microelectronics Journal (Elsevier) (since 2017). He was a Scholar of the Greek BODOSSAKI Foundation, from 2011 to 2014, and Santander Universities Program, in 2018 and 2019.

Mauricio Briceño of ARM


Machine Learning for Embedded and Internet of Things

Dr. Filip Maksimovic of INRIA


Fully On-Chip Transceiver Integration for Low-Power Wireless

In this talk, the speaker will summarize design tradeoffs of a number of core blocks used for on-chip radio frequency wireless communication with the ultimate goal of building a wireless device with no off-chip components. This will include a system-level perspective of design tradeoffs of low-noise amplifiers, power amplifiers, mixers, oscillators, and on-chip passives, with an emphasis on benefits and drawbacks of fully on-chip integration. The focus of this talk will be on low-power implementations suitable for short range, low datarate wireless communication protocols such as Bluetooth and IEEE 802.15.4. To conclude, a design example of an integrated transceiver will be presented along with a number of demonstrated and future applications of the chip.


Filip Maksimovic received the B.S. degrees in Electrical Engineering

and Aerospace Engineering from the University of Colorado, Boulder, in 2011, and the PhD degree in Electrical Engineering and Computer Science from the University of California, Berkeley, in 2018. He has been a researcher at Inria-Paris since 2021. His research interests include low-power radio frequency design, analog/mixed-signal sensor front-ends, and networking protocols for miniaturized IoT devices.

Daniel Musciano of Allegro MicroSystems


Allegro MicroSystems

Charla de la empresa Allegro MicroSystems sobre el trabajo que realizan desde su oficina en Argentina.


9:00 - 9:30 -> Bienvenida

9:30 - 10:45 -> Hanh-Phuc Le: "Integrated Power Converter - A Good Design Flow and Useful Techniques". En ingles.

11:00 - 12:15 -> Ioannis Vourkas: "Circuit Design for Memristive Devices -  Open Research Fields & Applications". En español.

12:1 5 - 13:00 -> Mauricio Briceño: "Machine Learning for Embedded and Internet of Things". En español.

14:30 - 15:45 -> Filip Maksimovic : "Fully On-Chip Transceiver Integration for Low-Power Wireless Communication". En inglés.

15:45 - 16:30 -> "Allegro Microsystems". En español.

16:45 - 17:30 -> "Microelectrónica en el AC3E". En español.

17:30 - 18:15 -> "Microelectrónica estudiantil en la UTFSM". En español.

Si te interesan los circuitos integrados o las herramientas de diseño asistido, no te pierdas las charlas de nuestros distinguidos invitados. Algunas presentaciones serán transmitidas vía Zoom.