Rakesh Kumar

The development of IEEE Technology Roadmaps bring together a bevy of international experts to chart out a mapping of continued evolution and predictions of the underlying basic technologies. In this talk I will show examples of the evolution of silicon, wide bandgap semiconductor, heterogeneous integration technologies and Next generation Networking Technologies and will illustrate how they provide the groundwork for making these humanitarian solutions possible.

I will provide select examples of some exciting solutions using Wireless and Compute technologies, IoT, AI/ML and similar capabilities to create solutions in spaces such as Agriculture, Healthcare, Smart Lighting and Power Generation and Distribution, and many others. Technology innovations are the enablers as we develop humanitarian solutions.

Biography:

Dr. Rakesh Kumar is a semiconductor industry veteran, an entrepreneur, and an educator. He is the founder, President & CEO of Technology Connexions. Currently he Chairs the IEEE Technical Activities Data-based Strategy AdHoc and Roadmaps committees. He also participates in the IEEE 2050, Future Directions and Industry Engagement committees. He has been an IEEE HKN Governor, and on the Boards of IEEE SSCS, TEMS, and SSIT. He educates and mentors in IEEE VoLT and potential entrepreneurs at UCSD. He was an Adjunct Professor at Yonsei University in 2013. Dr. Kumar authored the book “Fabless Semiconductor Implementation”, published by McGraw Hill. He is an IEEE Life Fellow and in the IEEE TAB Hall of Honor. During 40+ years in the semiconductor industry he has been VP&GM at Cadence Design, and has held various technical and management positions at Unisys and Motorola. He received the Ph.D.. M.S. in EE from the University of Rochester in 1974 and 1971, and the B.S from IIT Delhi in 1969, and an Executive “MBA” from UCSD in 1989.