IEEE-Ansys Electronics Reliability Validation Testing Series - Common Failure Mechanisms of Electronics Packages

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Whether in the defense, healthcare, consumer electronics, or communication industries, having a fundamental knowledge of electronic packaging reliability is now crucial in order to develop safe and durable products. In this webinar, the common overstress and wearout failure mechanisms found in electronics will be presented. The failure mechanisms to be discussed include fracture, fatigue, wear, time independent dielectric breakdown, dendrite growth, and more. The discussion of each mechanism will include a description of the failure, the common life models used to predict the failure, and methods to mitigate the failure. The presentation will conclude with a brief look into the next generation of electronics packages and the expected reliability concerns as packages become more advanced.

This presentation is part of a two-lecture miniseries covering electronics reliability validation testing. This lecture focusses on developing a fundamental background of electronics failures. The subsequent lecture will focus on developing validation tests based on the fundamental failure mechanisms presented here.

TAKEAWAYS:

• An understanding of the fundamental mechanical and electrical reliability concerns of electronics packages; once an understanding is developed, the mitigation techniques can be more easily conceived.
• A list of the common failure mechanisms in electronics packages and the common life stress models used to describe them.
• A glimpse into the future of electronic packaging and the reliability challenges that are predicted to arise.

We can offer Continuing Education Units (CEU) and Professional Development Hours (PDH), if requested.