Symposium on Reliability for Electronics and Photonics Packaging - REPP 2023 [hybrid]
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)
Symposium on Reliability for Electronics and Photonics Packaging [REPP]
Fourth year of this new Symposium from the IEEE Electronics Packaging Society. This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
For latest Advance Program and other details, please visit our website: attend.ieee.org/repp/
Date and Time
Location
Hosts
Registration
- Start time: 16 Nov 2023 08:00 AM
- End time: 17 Nov 2023 04:00 PM
- All times are (UTC-08:00) Pacific Time (US & Canada)
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- SEMI World Hdqtrs
- 673 S Milpitas Blvd
- Milpitas, California
- United States 95035
- Starts 22 August 2023 10:09 AM
- Ends 17 November 2023 09:00 AM
- All times are (UTC-08:00) Pacific Time (US & Canada)
- Admission fee ?
Speakers
Speakers from international labs, research institutions, and companies
Invited Plenary and Keynote Talks
Reliability of Molded Packages under High Field Conditions (Prof. Susanna Reggiani, Bologna Univ.)
Reliability Challenges in Silicon-based MEMS Technologies (Prof. Ashwin Seshia, Cambridge University)
Reliability Assessment for Heterogeneously Integrated Packages (Prof. Ganesh Subbarayan, Purdue University)
SiPh Reliability and Qualification (Angelo Miele, Cisco Systems Inc.)
Test Processes for JEDEC-compatible Heterogeneous Packaging Technology for Integrated Photonics (Sylwester Latkowski, Eindhoven University of Technology)
Intelligent Reliability: IRel 4.0 (Willem van Driel, Signify)
Recent Advances in Electromigration and Theromomigration Study (Prof. Xuejun Fan, Lamar University)
Power Electronics Reliability (Dr. Rene Poelma, Nexperia)
... plus an array of technical presentations.
Two days of detailed exploration of issues and solutions, with pre-Symposium tutorials on three of the event's topics.