October 2023 Pikes Peak Joint Electronic Devices/Circuits & Systems Chapter Meeting

#Internet #of #Things #Ferroelectric #RAM #FRAM #Magnetoresistive #MRAM
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The Pikes Peak Joint Electron Devices/Circuits & Systems Chapter is being reactivated after a 4 year inactivate period.  We invite all those interested in Semiconductor technology to participate in the local chapter again as Silicon Mountain begins to grow.  The Meeting is at the Tom Saponas Lounge on the first floor of the Engineering Building of the UCCS Campus.  Lunch will be provided by the Pikes Peak Section.

Our Presentation is Non-Volatile RAM For the Internet of Things (IOT)

The Internet of Things (IOT) is the vast network of computerized things (other than computers & servers).  Some these things include contract-less identification devices, smart cards, thermostats, smoke detectors, smart locks, video monitors, etc.  These IOT devices are typically low-power, low-cost single chip systems.  Today’s commodity memory technologies (DRAM, NAND Flash, NOR Flash) do not provide the optimum solution for these complex single chip systems.  New non-volatile memory technologies have emerged over the last 30-years to meet the needs of IOT.  This presentation covers the history and current status of ferroelectric RAM (FRAM) and magnetoresistive RAM (RAM) technologies and products.



  Date and Time

  Location

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  • Date: 26 Oct 2023
  • Time: 12:00 PM to 01:30 PM
  • All times are (UTC-06:00) Mountain Time (US & Canada)
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  • 1420 Austin Bluffs Parkway
  • Colorado Spring, Colorado
  • United States 80918
  • Building: Engineering Building
  • Room Number: 1st Floor, Tom Saponas Lounge

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  • Starts 26 September 2023 12:00 PM
  • Ends 25 October 2023 12:00 PM
  • All times are (UTC-06:00) Mountain Time (US & Canada)
  • No Admission Charge


  Speakers

David David of Vertical Memory

Topic:

Non-Volatile RAM For the Internet of Things (IOT)

The Internet of Things (IOT) is the vast network of computerized things (other than computers & servers).  Some these things include contract-less identification devices, smart cards, thermostats, smoke detectors, smart locks, video monitors, etc.  These IOT devices are typically low-power, low-cost single chip systems.  Today’s commodity memory technologies (DRAM, NAND Flash, NOR Flash) do not provide the optimum solution for these complex single chip systems.  New non-volatile memory technologies have emerged over the last 30-years to meet the needs of IOT.  This presentation covers the history and current status of ferroelectric RAM (FRAM) and magnetoresistive RAM (RAM) technologies and products.

Biography:

 David Bondurant has been involved with the computer and semiconductor industry for 52-years.  He was a computer architect at Control Data, Sperry-Univac, and Honeywell.  He was involved with the government-sponsored advanced semiconductor program called VHSIC (Very High Speed Integrated Circuits) at Univac & Honeywell where he developed microprocessor and ASIC semiconductor products in bipolar CML, CMOS, and radiation hard CMOS.  He was involved with emerging non-volatile RAM marketing at industry leading companies, Ramtron (FRAM), Enhanced Memory Systems (EDRAM, ESRAM), Simtek (non-volatile SRAM), and Freescale Semiconductor/Everspin Technologies (MRAM) as they became viable over the last 30-years.

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Agenda

Introductions

Lunch

Presentation (1-hour)