IEEE-USA Designing Chips with CHIPS: West Coast Pre-Silicon Summit
The CHIPS Act will have a profound impact on manufacturing in the United States, but what about Chip Design & Packaging?
IEEE-USA's Designing Chips with CHIPS: West Coast Pre-Silicon Summit is a one-day semi summit that will bring together leading thinkers from chip design and packaging companies, along with government policy makers, to discuss the chip design industry in light of the historic CHIPS Act. Held in-person at Qualcomm’s Irwin M Jacobs Hall on Qualcomm’s main campus in San Diego, California on 3 November 2023, this event will look at the CHIPS Act from the specific perspective of design firms and packaging companies, with a special focus on the west coast.
Details: chipdesign.ieeeusa.org
Date and Time
Location
Hosts
Registration
- Date: 03 Nov 2023
- Time: 03:00 PM UTC to 12:00 AM UTC
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- 5775 Morehouse Drive
- Irwin M Jacobs Qualcomm Hall
- San Diego, California
- United States 92121
- Building: Qualcomm Headquarters – Building N
- Contact Event Host
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IEEE-USA is an organizational unit of IEEE, created in 1973 to support the career and public policy interests of IEEE’s U.S. members. IEEE-USA is primarily supported by an annual assessment paid by U.S. IEEE Members. Learn more at: ieeeusa.org
- Co-sponsored by IEEE-USA
Agenda
8:00 AM Breakfast & Networking
8:30 AM Keynote – Industry perspectives
9:30 AM Breakout Sessions: Perspective from the Manufacturers
10:30 AM Morning Networking Break
11:00 AM Breakout Sessions: Perspective from Design and Packaging Firms
12:00 PM Lunch - Government Perspective
1:30 PM Breakout Sessions – Workforce Trends & Challenges
2:30 PM Afternoon Networking Break
3:00 PM Breakout Sessions – What's Coming Next?
4:00 PM Wrap-up