Prof. Tsu-Jae King Liu of University of California, Berkeley

Semiconductor technology advancements have enabled the capability and cost of computing devices to improve exponentially over time, with transformative impact - witness the rise of cloud computing and the Internet of Things, which together with advances in machine learning have ushered in the era of Artificial Intelligence (AI). Today’s leading-edge microprocessor chips comprise 80 billion transistors. The complexity of these semiconductor devices requires sophisticated design automation tools and manufacturing facilities, which are increasingly expensive and capital intensive: a leading-edge chip fabrication plant, or “fab,” costs roughly $10 billion. As a result, close collaboration between electronic design automation (EDA) companies, fabless chip design companies, chip manufacturers, wafer fabrication equipment (WFE) companies, materials suppliers, and outsourced semiconductor assembly and test (OSAT) companies is necessary to sustain the exponential pace of technology advancement.

This seminar will begin by providing a high-level overview to explain why chips are considered “the new oil,” with a market projected to grow to $1T by the end of this decade. Then it will discuss challenges ahead for the industry and the need for new innovations and talent. As an example, integration of nano-electro-mechanical switches with conventional CMOS transistors to enable dramatic improvements in computational speed and energy efficiency will be described. The importance of a culture of inclusion for spurring innovation with maximum positive impact will also be discussed.

Biography:

Dr. Tsu-Jae King Liu earned her B.S., M.S. and Ph.D. degrees in electrical engineering from Stanford University.  Since 1996 she has been a faculty member at the University of California, Berkeley in the Department of Electrical Engineering and Computer Sciences, where she has conducted research and taught courses on semiconductor devices and technology.  She was appointed Dean of the College of Engineering in July 2018. Liu has published over 550 publications and holds 96 U.S. patents.  She is a Fellow of the Institute for Electrical and Electronic Engineers (IEEE) and the National Academy of Inventors as well as an elected member of the U.S. National Academy of Engineering. She also serves on the Board of Directors for Intel Corp. and MaxLinear Inc. Her awards include the DARPA Significant Technical Achievement Award for development of the FinFET, a transistor design used in all leading-edge computer chips today.

Email:

Address:Department of Electrical Engineering and Computer Sciences (EECS), University of California, Berkeley, Berkeley, CA, United States, 94720