The Chip Act: A New Era in US Semiconductors
Welcome to Global Webinar co-sponsored by Pikes Peak Section and Panama Computer Society Chapter and co-hosted by a number of Chapters worldwide.
The Chip Act: A New Era in US Semiconductors
David Bondurant, Vertical Memory
Matt Francis, Ozark IC
This presentation will review 50-years of Semiconductor and Computer developments and historical competition between countries that developed. We observe the historical scaling of semiconductors (Moore’s Law) and the fact the Moore’s Law scaling is reaching it’s end. We review Beyond Moore changes to semiconductor processing and packaging technology required to continue computer performance improvement and why control of leading edge semiconductor and packaging manufacturing is now strategic.
The Chip Act is the United States response to demands of Beyond Moore requirements and need to bring manufacturing closer to home. We review the Chip Act and update on it’s developments during 2023.
Date and Time
Location
Hosts
Registration
- Date: 14 Dec 2023
- Time: 07:00 PM to 08:30 PM
- All times are (UTC-05:00) Eastern Time (US & Canada)
-
Add Event to Calendar
- Starts 03 December 2023 06:00 PM
- Ends 13 December 2023 06:00 PM
- All times are (UTC-05:00) Eastern Time (US & Canada)
- No Admission Charge
Speakers
David
The Chip Act: A New Era in US Semiconductors
Biography:
David Bondurant is a 50-year IEEE Life Senior Member. He developed computers at Control Data and Univac in the 1970s, VHSIC semiconductor and computer-aided design technology at Honeywell in the 1980s, and advanced memory technologies in 1990s and 2000s at companies like Ramtron, Enhanced Memory Systems, Simtek, Freescale & Everspin Technologies. In retirement, he volunteers with the IEEE and Computer Society working with Chapters and members around the world.
Matt
The Chip Act: A New Era in US Semiconductors
Biography:
A. Matt Francis, Ph.D. Matt is founder and President/CEO of Ozark Integrated Circuits, Inc (Fayetteville, AR). He holds BSEE, BS Physics, MS and PhD degrees from the University of Arkansas. At Ozark IC, he leads development of high-temperature semiconductor computing solutions for energy, defense, aerospace and space applications, and has served as a remote payload specialist for Ozark IC’s payloads on the International Space Station. He coordinates complex semiconductor (thin-film, thick-film and packaging) supply chains, and serves in a number of advisory and elected roles within government and industry. Within IEEE, he serves as a Region Director, Elect (Region 5 USA Southwest), as the IEEE-USA representative to the IEEE Industry Engagement Committee, and in numerous committees within IEEE MGA. He is also an advisor to science-based startups through the Winrock International Science Venture Studio.
Agenda
Welcome
Presentation
Discussion and Questions