MTT-S Dallas: CFP - 2024 IEEE TEXAS SYMPOSIUM ON WIRELESS & MICROWAVE CIRCUITS AND SYSTEMS
Call for Papers
The IEEE Texas Symposium on Wireless & Microwave Circuits and Systems invites paper submissions for the 2024 conference, to be held in-person April 3–4, 2024 at Baylor University in Waco, Texas.
Authors from academia, industry, government labs, and other organizations around the world are invited to submit papers based on their original and previously unpublished work in all areas listed below (and similar related areas):
- RF and microwave circuits and systems
- 5G/6G and millimeter-wave/THz wireless technologies
- Wireless technologies for biomedical applications
- Computational electromagnetics
- Antennas, propagation, and electromagnetics
- Spectrum management and coexistence
- RF active and passive devices
- Microwave metrology
- Wireless power transfer
- Electromagnetic materials and modeling
- Wireless and optical communications
- Photonics
- Geophysical and subsurface modeling
- Radar and sensing
- Internet of Things
- Emerging wireless technologies
2024 Special Session: Emerging Neurotechnologies for Brain-Machine Interfaces
In addition to the paper presentation sessions, the symposium will include invited talks and tutorials from leading experts in fields related to the conference. The conference also offers a student research competition that is open to both graduate and undergraduate students, in addition to other student and industry engagement events. Awards will be given for the best student research presentations.
We look forward to your participation in the 2024 symposium!
Casey Latham, Keysight Technologies
General Chair
Important Dates:
Paper Submission Deadline: February 5, 2024
Author Notification: March 4, 2024
Final Manuscript Due: March 13, 2024
Advance Registration Deadline: March 25, 2024
Texas Symposium: April 3-4, 2024
Paper submission instructions can be found at the conference website: www.TexasSymposium.org.
Papers accepted for publication and presented at the conference will be submitted to IEEE Xplore®.
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