Chris Bailey of University of Greenwich

3D-Printing or Additive Manufacturing has received significant media attention during the last five years. In 2012 the Economist published an article on this technology which stated that it will lead to the 3^rd industrial revolution. A number of companies are now commercialising materials, design tools and 3D-Printers, and these are being used in a number of sectors for digital manufacturing including aerospace, medical, construction and consumer products.

But what impact is 3D-Printing having on electronic packaging and manufacturing? Companies that produce and sell 3D-Printers as well as EDA and MCAD companies are now promoting 3D-Printing towards the electronics sector. A number of research programmes are also underway to aim to make 3D-printing a reality in producing truly 3D-electronic systems. One example being EU project Nextfactory [http://www.nextfactory-project.eu] which is developing printing, micro-assembly, and curing systems that will accurately deposit and cure both functional and structural materials and place/embed components in an integrated manner within a single platform. This paper will detail the current status of 3D-printing for the manufacture and packaging of electronic systems, and provide some insights on how it may impact our community in the future. Challenges related to the performance and electrical behaviour of printed conductive materials will also be discussed as they must meet or better the performance of materials currently used. And of course the overall quality and reliability of any 3D-printed electronic system must meet industry requirements. The paper will also detail developments taking place in design and modelling tools and how these can be used in addressing some of these challenges.

Biography:

Chris Bailey is the Professor of Computational Mechanics and Reliability at the University of Greenwich, London, United Kingdom. He received his PhD in Computational Modelling from Thames Polytechnic in 1988, and an MBA in Technology Management from the Open University in 1996. Before joining Greenwich in 1991, he worked for three years at Carnegie Mellon University (USA) as a research fellow in materials engineering. His research has resulted in over 250 publications. He is currently an Associate Editor for the CPMT Transactions and has been a guest editor on the journal of Soldering and Surface Mount Technology. In 2008 he was the General Chair for the IEEE ESTC conference in London and is a regular attendee and committee member of CPMT conferences such as ECTC and EPTC as well as conferences such as Eurosime (Europe), ICEPT (China), and IMPACT (Taiwan). In 2014 he organised the Therminic Conference in Greenwich, London. His research interests are related computational methods for design of engineering components and systems. Chris is a Senior Member of IEEE, Member of IET and is current Vice-President for conferences for IEEE-CPMT society.

Address:University of Greenwich, , Greenwich, United Kingdom

Chris Bailey of University of Greenwich

Biography:

Address:Greenwich, United Kingdom