Addressing the Challenges of Electrically Large Antenna Systems Design
This presentation will address design considerations for RF Microwave Components, Sub-Systems and Antenna design for large multi feed antenna systems. The presentation will cover RF Microwave Component and Feed Systems, Co-Site interference, system mounting on platform considerations, high power/thermal design considerations. Also covered are design techniques as well as advanced simulation techniques such as automated 3D simulation for layer based structures including microstrip and stripline, 3D Component modeling, and multiphysics analysis.
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For Inquiries, please contact:
Kirit Dixit (201-669-7599), Russell Pepe (201-960-6796), Har Dayal (973-628-7394),Ajay Poddar (973-881-8800)and/or George Kannell (973-437-9990).
- Co-sponsored by AP/MTT Chapter
Speakers
Bill McGinn of Ansys.com
Addressing the Challenges of Electrically Large Antenna Systems Design
This presentation will address design considerations for RF Microwave Components, Sub-Systems and Antenna design for large multi feed antenna systems.
Biography:
Bill McGinn is currently a Lead Application Engineer for Ansys Inc. In the past he has worked as a hardware design engineer and was involved in the development of RF/Microwave hybrid components, MMICs and subsystems. Additionally, as a designer in a high-speed digital IC group, he led a CAD effort, and contributed to the generation of active device models for transistors, diodes and other microwave components. In the recent past he worked for Ansoft Corporation specializing in high frequency circuit and system level design and simulation. As an Engineering Director he was responsible for QA, Customer Support and Production. Currently as a Lead Applications Engineer for Ansys, he is involved with application development and product definition aimed at both component and system level design. He has most recently been involved in application development and system simulation for wireless applications as well as electromagnetic and thermal simulation of RF/microwave components. He has written multiple articles and holds a BSEE from Stevens Institute of Technology as well asa Business degree from St. Peters University in NJ.
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Agenda
FREE Registration is on-site. Further details can be found in the IEEE North Jersey Newsletter and the website
http://sites.ieee.org/northjersey/events/2015-ap-mtt-symposium
All are welcome. IEEE membership is not required. Registration is on-site. There is no charge to attend the symposium or mini-show. A complementary breakfast will be provided and lunch is included for all.
For further information, please contact:
Chair/Exhibition | Kirit Dixit | 201-669-7599 | kdixit@microcomsales.com |
Chair MTT/AP Symposium | Har Dayal | 973-633-4618 | dayalhar@gmail.com |
Technical Program Chair | George Kannell | 973-437-9990 | gkk@lgsinnovations.com |
Publicity | Arthur Greenberg | a.h.greenberg@ieee.org | |
Event/Location Coordinator | Ken Oexle | 973-386-1156 | |
MTT/AP Chapter Chair | Dr. Ajay Poddar | 201-560-3806 | akpoddar@synergymwave.com |
MTT/AP Chapter Vice-Chair | Prof. Edip Niver | 973-596-3542 | edip.niver@njit.edu |
Event Coordinator | Russell Pepe | 201-960-6796 | rcpepe@ieee.org |