John S. Mazurowski of Penn State Applied Research Laboratory

Abstract: 

The IEEE Photonics Society / Standards Committee recently published a whitepaper on Fiber Attach.  Transmission of light between or in and out of any photonic platform normally requires attachment to a fiber that is used as a flexible optical waveguide.  An effective fiber attach involves many requirements and metrics that have so far involved decades of research.  The presentation will cover the whitepaper in detail, some technical background, the path forward, and how to become involved.

Biography:

Biography: 

Mr. Mazurowski is the Director of the Electronics Manufacturing Center, a Navy Manufacturing Technology Center of Excellence, located within the Penn State Applied Research Laboratory; the center began operation in 2021. Previously he was the Head of the Fiber Optics and Photonics Department, a position he held since 2018.  During 2005-2018 he led key projects in manufacturing technology.  Before coming to Penn State, he was a Senior Engineer at Corning Photonics Division / Avanex Incorporated as a project engineer in advanced photonics manufacturing engineering.  Prior to that Mr. Mazurowski was Manager of Manufacturing Engineering / Senior Electronics Engineer at Biocontrol Technology, where he worked in developing optical instruments for measurement of skin tissue constituents.  Prior to that, Mr. Mazurowski was a Materials Engineer at the General Electric Electronics Laboratory where he developed new III-V heterostructures for photonic and high speed electronic devices using Molecular Beam Epitaxy (MBE).  He also developed characterization systems and methods for millimeter wave materials, devices, and integrated circuits.  He began his career in avionics and in product design at Harris RF Communications.  

Mr. Mazurowski has over forty publications and presentations relating to solid state materials, electronics, and photonics, and holds three patents in the areas of design and packaging.  He is the chair of the IEEE Pittsburgh Electronic Packaging and Electron Devices Chapter, former chair of the SAE AS-3 Fiber Optic and Applied Photonics Committee, and former chair of the IMAPS Cleveland/Pittsburgh chapter.  He is a Senior Member of the IEEE, a member of IMAPS, and a member of SAE.  He earned his BS and MS in Physics at Syracuse University.