Dr. Shashank Krishnamurthy of Otis Elevator Company

As applications continually push electronic designs to be more dense, traditional power electronic fabrication and assembly techniques must be reevaluated for opportunities to make hardware smaller and lighter. Applying new printed circuit board (PCB) fabrication technology to physically embed die-level switching devices between internal layers enables a reduction in the overall package volume of inverter systems and decreases power trace lengths. In addition, the reduced power dissipation and increased switching frequency afforded by wide bandgap devices makes them a sensible choice for use in high density inverter designs. This talk will cover the salient aspects of PCB embedded packaging and will highlight some of the challenges and applications of such an approach.

Biography:

Shashank Krishnamurthy received his MS in Electrical Engineering from Iowa State University and a PhD in Electrical Engineering from University of Wisconsin-Madison with a focus on power electronics and microgrids. After graduation he worked at United Technologies Research Center where he led R&D activities in the areas of power conversion, wide band gap devices and packaging. He is currently a Chief Engineer with the Otis Elevator Company where he is responsible for the dispatching product portfolio. Shashank is senior member of IEEE and was the chair of the power electronics devices and components committee of the IEEE Industry Applications Society.