Interdisciplinary Conference on Electrics and Computer (INTCEC 2024)
The paper submission deadline has been extended to 15 February 2024.
Online & Physical Participation Opportunity
We are inviting you to attend the 4. Interdisciplinary Conference on Electrics and Computer (INTCEC 2024), which will take place in Romeoville, Illinois during 11 - 13 June 2024 under the organization of Lewis University. Romeoville is located about 35 miles southwest of downtown Chicago, IL and about 30 miles south of O’Hare International Airport. This fourth event will be in hybrid mode, thereby you can present your papers physically or online via a zoom link at the confeence time. The goal of INTCEC 2024 is to gather scientists, engineers and researchers working on electrics, electronics and computer in an interdisciplinary manner. The event is expected to have cutting-edge studies on Electrical and Computer Systems. It will give an international and interdisciplinary media to present the technical studies and discuss the scientific and engineering issues to arrive at more complete systems for the applications of future world. Thus, our theme is "interdisciplinary" approach for the engineering problems on Electrics & Computer Sciences.
Date and Time
Location
Hosts
Registration
- Start time: 11 Jun 2024 12:00 AM
- End time: 13 Jun 2024 12:00 AM
- All times are (UTC-05:00) Central Time (US & Canada)
- Add Event to Calendar
Agenda
The topics of the conference include (but are not limited to):
- Track I: Electronics
- Track II: Communication
- Track III: Computing and Systems
- Track IV: Electrics
DEADLINES
Full-Text Paper Submission Deadline | 15 February 2024 |
Notification of Acceptance/Rejection (before/on) | 15 March 2024 |
Final Paper (Camera Ready) Submission | 10 April 2024 |
Early Bird Registration | 20 March 2024 |
Late Registration | 20 April 2024 |
Conference Dates | 11-13 June 2024 |
- The conference will be held only physical on 11 June 2024, and only online on 12-13 June 2024. - All physical participants get certificate and conference kit. |