Mukta Farooq of GLOBALFOUNDRIES

Abstract:

2.5D/3D integration technology encompasses a wide variety of configurations which employ TSVs (Through Silicon/Substrate Vias) in a silicon wafer. 2.5D generally refers to heterogeneous integration of chips using interposers which typically have only passive components: wiring, capacitors and inductors. 3D technology goes beyond the interposer by integrating logic functionality in the assembly. 3D integration has the ability to enhance system performance by increasing bandwidth, reducing wire delay, and enabling better power management. In 3D technology, the TSVs may be integrated into the CMOS transistor fabrication at a number of points in the manufacturing sequence. Key considerations to determine the optimal introduction point include the size of the TSV, dimensional compatibility of the TSV with the BEOL (Back End Of Line) features, and the wiring design requirements. In this talk, we will review the various types of 2.5D and 3D integration, and why they offer significant advantages over conventional methods. We will also discuss the key elements of TSV fabrication including via etching, insulation, metallization, annealing, capping, as well as wafer grindside processing. Finally we will discuss the effects of TSVs on devices and BEOL structures, and the type of reliability testing that is required to evaluate the long-term impact of TSVs.

Biography:

Dr. Mukta Farooq, a GlobalFoundries Fellow, is the technical leader for 7 nm Advanced Silicon Packaging. She is a materials scientist, with expertise in 2.5D/3D integration, die stacking, BEOL, C4/BGA/CGA, lead-free alloys, chip package interaction and intellectual property development. She has led numerous technology programs to successful qualifications, including 3D 32 nm CMOS technology with Cu TSV, 2.5D heterogeneous interposer technology, and lead-free interconnects for CMOS die at multiple nodes. Mukta holds 190 granted patents and was designated Lifetime Master Inventor and Academy of Technology Member at IBM. She has 30 external publications, and has given invited talks and tutorials. Mukta is an IEEE Fellow, EDS (Electron Device Society) Distinguished Lecturer, EDS Governor, Regional Editor - EDS Newsletter, and Chair, EDS Mid-Hudson Chapter. She received her BS from IIT Bombay, MS from Northwestern University, and PhD from Rensselaer Polytechnic Institute.

Email:

Address:GLOBALFOUNDRIES, 2070 Route 52, East Fishkill, New York, United States, 12533

Mukta Farooq of GLOBALFOUNDRIES

Biography:

Email:

Address:East Fishkill, New York, United States