Daniel Renner of Atacama Optics & Electronics

Photonic integration has been at the center of photonic activity for several years. Over this period, great strides have been made to increase the integration density and integrated chip functionality. This talk will work its way up from the drivers for photonic integration – why do we need Photonic Integrated Circuits (PICs)? What are their similarities and differences with Electronic Integrated Circuits (EICs)? This analysis of integration drivers will lead to a discussion of recent progress on the main paths: monolithic, heterogeneous and hybrid. The talk will conclude with possible approaches to meet the additional demanding considerations for future Quantum PICs.

Biography:

Dr. Daniel Renner grew up in the southern part of Chile, in South America. He received his Bachelor of Engineering Degree from the Universidad de Chile and then, in his early twenties, he went to the University of Cambridge in England to do a Ph.D. in opto-electronics, a new field of studies at the time. Now, decades later, he has lived through the whole range of experiences that relate to the research, development, manufacturing and commercialization of complex photonic devices and systems, used in communication, sensor and industrial applications. In the past 30 years, Daniel has been directly involved with the growth of four photonic start-ups in the United States, Ortel Corporation, Agility Communications, Aerius Photonics and Freedom Photonics. This gives him a unique perspective on the workings of a high-tech small business. Daniel is currently the Chair of the IEEE Photonics Society Industry Engagement Committee, from where he is trying to help other photonic small businesses.