Technical Meeting - Photo Chemical Milling of Thin Metals for Electronic Components and Electro-Plating of Thin Metals
Technical Meeting
Mr. Ken Marino
Orbel
Meal Sponsor
Mr. Ken Marino
Orbel
The Huntsville, AL Chapter of the IEEE Electromagnetic Compatibility (EMC) Society invites you to participate in a Technical Meeting on March 28, 2024, featuring a talk given by Mr. Ken Marino of Orbel. The program will begin at 5:30 pm with Mr. Ken Marino of Orbel sponsoring a free meal. Mr. Marino’s technical presentation will begin at approximately 6:20 pm after some short chapter status updates.
Date and Time
Location
Hosts
Registration
- Date: 28 Mar 2024
- Time: 05:30 PM to 07:30 PM
- All times are (UTC-05:00) Central Time (US & Canada)
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- 965 Exploer Blvd NW
- Huntsville, Alabama
- United States 35806
- Building: East Tower
- Room Number: Fountain View
- Contact Event Host
- Co-sponsored by Meal Sponsor: Orbel
- Survey: Fill out the survey
- Starts 20 March 2024 12:00 PM
- Ends 27 March 2024 05:00 PM
- All times are (UTC-05:00) Central Time (US & Canada)
- No Admission Charge
Speakers
Mr. Ken Marino of Orbel
Photo Chemical Milling of Thin Metals for Electronic Components and Electro-Plating of Thin Metals
Synopsis: This presentation will address photoetching and electroplating specifically for EMI / RFI requirements. Photoetching of light gage metals supports EMI / RFI requirements via the production of tight tolerance board level shields and finger stock in an economical manor. Incorporating electroplating on the part surface allows for a fully engineered solution. Electroplating can create a solderable surface, enhance conductivity, or prevent corrosion of the base metal. By specifying a combination of base metals and electroplating an economical, high-performance solution can be supplied.
Jack McFadden of ETS-Lindgren
MIL-STD-461G Conducted Susceptibility CS114 System Considerations
This presentation will demonstrate the test system design considerations and risks associated with different system designs. It is based on a PJ3471 case study.
Biography:
Jack McFadden is an EMC Systems Engineer with ETS-Lindgren in Cedar Park, Texas since 2012. His responsibilities include EMC test system design and integration. He earned a Bachelor of Science Degree from Athens State University, Athens, AL. Mr. McFadden is an iNARTE certified EMC engineer as well as an iNARTE certified EMC technician with over 25 years experience in EMC test systems and software development. He is a certified tester foundation level (CTFL) per the American Software Testing Qualifications Board, Inc. (ASTQB). He may be reached at Jack.McFadden@ets-lindgren.com.
Email:
Address:United States
Agenda
”Photo Chemical Milling of Thin Metals for Electronic Components and Electro-Plating of Thin Metals”
Synopsis: This presentation will address photoetching and electroplating specifically for EMI / RFI requirements. Photoetching of light gage metals supports EMI / RFI requirements via the production of tight tolerance board level shields and finger stock in an economical manor. Incorporating electroplating on the part surface allows for a fully engineered solution. Electroplating can create a solderable surface, enhance conductivity, or prevent corrosion of the base metal. By specifying a combination of base metals and electroplating an economical, high-performance solution can be supplied.
Chris Lowe
Chair, Huntsville Chapter
IEEE EMC Society
Email: christopher.lowe@ieee.org