Chemical Mechanical Polishing (CMP) for Hybrid Bonding

#cmp #cemical #mechanical #polishing #hybrid #bonding

This talk provides a comprehensive overview of Chemical Mechanical Polishing (CMP) for Hybrid Bonding in semiconductor manufacturing. CMP is defined as a technique that combines chemical and mechanical forces to planarize films. The role of CMP in hybrid bonding (HB) is explored, emphasizing its significance in achieving controlled dishing and surface roughness. Key challenges in CMP for HB, such as scratches, dishing, and loading are addressed along with strategies for managing them. The talk concludes by emphasizing the importance of co-optimization of CMP for HB and its implications in semiconductor manufacturing and advanced packaging.