Ashok Alagappan of Ansys

The semiconductor industry has witnessed steady growth over the last few years thanks to emerging applications, which are driving the growth of major semiconductor components. Reliable operation of these components is very important in any given application and to ensure reliability components must receive extensive testing and burn-in. Despite this, integrated circuit (IC) failures are still inevitable.

One of the common failure mechanisms that affects all IC components irrespective of the type of application is electrical overstress (EOS). EOS can affect components without warning, and when EOS does happen, the damage is done, and the functionality cannot be recovered.

In this webinar, we will discuss the possible root cause of EOS failures, why it ranks high in the failure pareto, and ways to mitigate EOS failure risks.

Biography:

Ashok Alagappan has over 15 years of experience in the Semiconductor industry, specializing in design and manufacturing of semiconductor products.  At Ansys, he works with customers across the spectrum, from aerospace, automotive to commercial, providing expert analysis and solutions for defining and improving reliability of electronic products and Integrated Circuit (IC) components.