Talk-1: Singularity Treatment Techniques for Solving Electromagnetic Integral Equations ; Talk-2 The Future of Education: Integrating AI, ML, VR, MR, Gamification and cloud for Personalized, scalable and Cost-Effective Education.

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Talk-1: Singularity Treatment Techniques for Solving Electromagnetic Integral Equations
Electromagnetic (EM) problems can be described by integral equation approaches, which include surface integral equations (SIEs), volume integral equations (VIEs), and volume-surface integral equations (VSIEs). All these equations include the L operator, K operator, or both. The kernel of the L operator is the dyadic Green’s function, which includes a double gradient operation on the scalar Green’s function and results in 1/R3 hypersingular integrals (HSIs), where R is the distance between a source point and an observation point or field point. Although the HSIs could be reduced to 1/R weakly singular integrals (WSIs) in the method of moments (MoM) solution by using a divergence-conforming basis/testing function like the Rao-Wilton-Glisson (RWG) basis/testing function, we must carefully handle the HSIs in some numerical methods like Nyström method, meshless method, or boundary element method because they do not use any basis and testing functions. In the K operator, the kernel is a single gradient operator on Green's scalar function, yielding 1/R2 strongly singular integrals (SSIs). The SSIs always exist in the K operator, even in the MoM solutions. It could also exist in the L operator in the MoM when the RWG basis function is used to represent both the electric and magnetic current densities in penetrable objects. The accurate and efficient evaluation of singular integrals in matrix elements is essential for solving EM integral equations because they significantly impact the numerical solutions. In this talk, we will present some robust singularity treatment techniques we developed for those singular integrals and provide numerical examples to demonstrate their applications for solving real-world problems. 
 
Talk-2: The Future of Education: Integrating AI, ML, VR, MR, Gamification, and Cloud for Personalized, Scalable, and Cost-Effective Education.        
Integrating AI, ML, VR, MR, gamification, and cloud computing in education offers a comprehensive approach to providing personalized, scalable, and cost-effective learning experiences. AI and ML algorithms analyze student data to personalize content and learning paths. VR and MR technologies provide immersive and interactive learning experiences. Gamification elements motivate and engage students, while cloud computing ensures accessibility, scalability, and cost-efficiency. Together, these technologies empower educators to deliver high-quality education tailored to individual needs, regardless of geographical location or resource constraints.
   
The meeting is an in-person event. However, a Zoom link is provided for remote attendance.

Here is the Zoom link: https://montclair.zoom.us/j/2423669227

Venue: Montclair State University

Room: Center for Environmental and Life Sciences (CELS) Building, Room CELS 120

Parking: Red Hawk Deck, Montclair State University

Event Time: 6:00 PM to 7:30 PM

5:45 PM - Refreshments (Pizza) and Networking

6:00 PM-6:45 PM: Talk by Prof. Mei Song Tong  

6:45 PM-7:30 PM: Talk by Mr. Vishal Kumar

You do not have to be an IEEE Member to attend. Refreshment is free for all attendees. Please invite your friends and colleagues to take advantage of this Invited Distinguished Lecture.

 

 


  Date and Time

  Location

  Hosts

  Registration


  • Date: 31 May 2024
  • Time: 06:00 PM to 07:30 PM
  • All times are (UTC-04:00) Eastern Time (US & Canada)
  • Add_To_Calendar_icon Add Event to Calendar
  • Montclair State University
  • Center for Environmental and Life Sciences (CELS)
  • Montclair, New Jersey
  • United States 07043
  • Building: CELS Building, Room CELS 120
  • Contact Event Hosts

  • Ajay K. Poddar, Ph.: 201-560-3806, email: akpoddar@ieee.org

    Edip Niver, email: edip.niver@njit.edu

    Anisha Apte, email: anisha_apte@ieee.org

    Durga Misra, email:dmisra@njit.edu

    Hong Zhao, email: zhao@fdu.edu

     

     

     

  • Co-sponsored by IEEE North Jersey Section and IEEE Montclaire University Student Branch
  • Starts 20 May 2024 12:00 AM
  • Ends 31 May 2024 04:00 PM
  • All times are (UTC-04:00) Eastern Time (US & Canada)
  • No Admission Charge

  Speakers

Prof. Meisong Tong of Tongji University

Topic:

Singularity Treatment Techniques for Solving Electromagnetic Integral Equations

Electromagnetic (EM) issues can be characterized by integral equation methods, which include surface integral equations (SIEs), volume integral equations (VIEs), and volume-surface integral equations (VSIEs). These equations involve using the L operator, K operator, or both. The L operator's kernel is the dyadic Green’s function, which involves a double gradient operation on the scalar Green’s function, resulting in 1/R^3 hypersingular integrals (HSIs), where R represents the distance between a source and an observation or field point. HSIs can be transformed into 1/R weakly singular integrals (WSIs) in the method of moments (MoM) by using a divergence-conforming basis/testing function like the Rao-Wilton-Glisson (RWG) function. However, HSIs require careful handling in numerical methods such as the Nyström, meshless, or boundary element methods, which do not use basis and testing functions.
The kernel for the K operator is a single gradient operation on Green's scalar function, resulting in 1/R^2 strongly singular integrals (SSIs). SSIs are always present in the K operator, including in MoM solutions, and may also appear in the L operator within MoM solutions when the RWG basis function represents electric and magnetic current densities in penetrable objects. Precise and efficient evaluation of singular integrals in matrix elements is crucial for resolving EM integral equations, as they significantly impact numerical solutions.
In this presentation, we will introduce robust singularity treatment methods we have developed for these integrals and provide numerical examples to demonstrate their effectiveness in addressing real-world challenges.

 

Biography:

  • Meisong Tong received his B.S. and M.S. degrees from Huazhong University of Science and Technology in Wuhan, China, and his Ph.D. from Arizona State University in Tempe, Arizona, USA, all in electrical engineering. He currently holds the positions of Distinguished Professor and Head of the Department of Electronic Science and Technology, as well as Vice Dean of the College of Microelectronics at Tongji University in Shanghai, China. Additionally, he has served as an adjunct professor at the University of Illinois at Urbana-Champaign in Illinois, USA, and as an honorary professor at the University of Hong Kong. He has authored over 600 papers for refereed journals and conference proceedings and has co-authored eight books or book chapters. His research covers electromagnetic field theory, antenna theory and techniques, RF/microwave circuits and devices modeling and simulation, interconnect and packaging analysis, inverse electromagnetic scattering for imaging, and computational electromagnetics. Prof. Tong is a Fellow of the Electromagnetics Academy, the Japan Society for the Promotion of Science (JSPS), and a Full Member of Commission B of the USNC/URSI. He has chaired the Shanghai Chapter of the IEEE Antennas and Propagation Society since 2014 and the SIGHT committee in 2018. He has also been an associate editor or guest editor for several prestigious international journals, including the IEEE Antennas and Propagation Magazine, the IEEE Transactions on Antennas and Propagation, and the IEEE Transactions on Components, Packaging, and Manufacturing Technology. He has contributed to the International Journal of Numerical Modeling: Electronic Networks, Devices and Fields, Progress in Electromagnetics Research, and the Journal of Electromagnetic Waves and Applications, among others. His roles have included session organizer/chair, technical program committee member/chair, and general chair at various prestigious international conferences. Prof. Tong's accolades include a Visiting Professorship Award from Kyoto University, Japan, in 2012 and from the University of Hong Kong, China, in 2013. He has mentored and co-authored 14 papers that have received the Best Student Paper Award at different international conferences. His awards include the Travel Fellowship Award from USNC/URSI at the 31st General Assembly and Scientific Symposium (GASS) in 2014, the Advance Award of Science and Technology from the Shanghai Municipal Government in 2015, the Fellowship Award of JSPS in 2016, the Innovation Award of Universities' Achievements from the Ministry of Education of China in 2017, the Innovation Achievement Award of Industry-Academia-Research Collaboration of China in 2019, the "Jinqiao" Award from the Technology Market Association of China in 2020, the Baosteel Education Award of China in 2021, the Carl Friedrich von Siemens Research Award from the Alexander von Humboldt Foundation of Germany in 2023, and the Technical Achievement Award from the Applied Computational Electromagnetic Society (ACES) of the USA in 2024. In 2018, he was chosen as the Distinguished Lecturer (DL) of the IEEE Antennas and Propagation Society for 2019-2022.

Email:

Address:Department of Electronic Science and Technology, Tongji University, Shanghai, China

Vishal Kumar of Ocean2Sand

Topic:

The Future of Education: Integrating AI, ML, VR, MR, Gamification, and Cloud for Personalized, Scalable, and Cost-Effect

By integrating Artificial Intelligence (AI), Machine Learning (ML), Virtual Reality (VR), Mixed Reality (MR), gamification, and cloud computing in educational settings, a comprehensive and innovative approach to personalized, scalable, and cost-effective learning experiences can be achieved. AI and ML algorithms are crucial in analyzing student data to tailor content and learning paths to individual needs. VR and MR technologies provide students with immersive and interactive learning experiences, enhancing their understanding and engagement. The incorporation of gamification elements motivates and captivates students, while cloud computing ensures accessibility, scalability, and cost-efficiency of educational resources. Together, these advanced technologies empower educators to deliver high-quality education specifically tailored to each student's unique needs, breaking down geographical barriers and resource limitations.

Industries such as heavy motor, finance, and underground drilling have the opportunity to revolutionize their training, simulation, and advertising techniques by integrating cutting-edge technologies such as augmented reality (AR), virtual reality (VR), metaverse, artificial intelligence (AI), gamification, Internet of Things (IoT), Web3, and cloud computing. Through the use of AR/VR, real-time data can be seamlessly overlaid onto machinery, providing valuable insights and enhancing operational efficiency. VR can create immersive and realistic training scenarios, while the metaverse can offer boundless virtual training spaces, transcending physical limitations. AI can personalize training programs to meet individual needs, while gamification techniques can increase trainees' engagement and motivation. Additionally, IoT can capture and analyze real-time data, empowering organizations to make data-driven decisions. Web3 can enable the development of decentralized training platforms, fostering collaboration and knowledge sharing across the industry. Furthermore, cloud technology can deliver the scalable infrastructure needed to support these innovative training initiatives. By leveraging these advanced technologies, industries can achieve safer operations, streamlined workflows, and enriched learning experiences for their workforce.

 

Biography:

Name: Vishal Kumar

CTO | Co-Founder - Ocean2Sand LLC

2 River Drive, Elmwood Park, NJ 07407, UISA

Email: ocean2sand.usa@gmail.com

Past Experience: Chief Software Architect | Product Manager | Research Scientist - Digital Control Inc.

Founder - MetaTel | Poddar Apps

Engineering Manager | Chief Engineer - Synechron

Linkedin: https://www.linkedin.com/in/vishalkumarpoddar/

Industry Experience: 20+ years

Email: tovpoddar@gmail.com

Phone: +919881461355

Address: Pune, India

 

Email:

Address:2 River Drive, , Elmwood Park, United States, 07407





Agenda

The meeting is an in-person event. However, a Zoom link is provided for remote attendance.

Here is the Zoom link: https://montclair.zoom.us/j/2423669227

Venue: Montclair State University

Room: Center for Environmental and Life Sciences (CELS) Building, Room CELS 120

Parking: Red Hawk Deck, Montclair State University

Event Time: 6:00 PM to 7:30 PM

5:45 PM - Refreshments (Pizza) and Networking

6:00 PM-6:45 PM: Talk by Prof. Mei Song Tong  

6:45 PM-7:30 PM: Talk by Mr. Vishal Kumar

You do not have to be an IEEE Member to attend. Refreshment is free for all attendees. Please invite your friends and colleagues to take advantage of this Invited Distinguished Lecture.